Synchrotron-based EUV exposure tools continue to play a crucial roll in the development of EUV lithography. Utilizing a programmable-pupil-fill illuminator, the 0.3-NA microexposure tool at Lawrence Berkeley National Laboratory's Advanced Light Source synchrotron radiation facility provides the highest resolution EUV projection printing capabilities available today. This makes it ideal for the characterization of advanced resist and mask processes. The Berkeley tool also serves as a good benchmarking platform for commercial implementations of 0.3-NA EUV microsteppers because its illuminator can be programmed to emulate the coherence conditions of the commercial tools. Here we present the latest resist and tool characterization results from ...
A 0.5-NA extreme ultraviolet micro-field exposure tool has been installed and commissioned at beamli...
The level of flare present in a 0.3-NA EUV optic (the MET optic) at the Advanced Light Source at Law...
One of the major challenges facing the commercialization of extreme ultraviolet (EUV) lithography re...
For volume nanoelectronics production using Extreme ultraviolet (EUV) lithography [1] to become a re...
The recent development of high numerical aperture (NA) EUV optics such as the 0.3-NA Micro Exposure ...
The recent development of high numerical aperture (NA) EUV optics such as the 0.3-NA Micro Exposure ...
With demonstrated resist resolution of 20 nm half pitch, the SEMATECH Berkeley BUV microfield exposu...
Operating as a SEMATECH resist test center, the Berkeley 0.3-NA EUV microfield exposure tool continu...
Microfield exposure tools (METs) continue to play a dominant role in the development of extreme ultr...
The resolution limit of present 0.3 NA 13.5 nm wavelength micro-exposure tools is compared to next g...
Microfield exposure tools (METs) continue to playa dominant role in the development of extreme ultra...
Microfield exposure tools (METs) play a crucial role in the development of extreme ultraviolet (EUV)...
Extreme ultraviolet (EUV) lithography is under development for possible deployment at the 32-nm tech...
A 0.5-NA extreme ultraviolet micro-field exposure tool has been installed and commissioned at beamli...
Although tremendous progress has been made in the crucial area of fabrication of extreme ultraviolet...
A 0.5-NA extreme ultraviolet micro-field exposure tool has been installed and commissioned at beamli...
The level of flare present in a 0.3-NA EUV optic (the MET optic) at the Advanced Light Source at Law...
One of the major challenges facing the commercialization of extreme ultraviolet (EUV) lithography re...
For volume nanoelectronics production using Extreme ultraviolet (EUV) lithography [1] to become a re...
The recent development of high numerical aperture (NA) EUV optics such as the 0.3-NA Micro Exposure ...
The recent development of high numerical aperture (NA) EUV optics such as the 0.3-NA Micro Exposure ...
With demonstrated resist resolution of 20 nm half pitch, the SEMATECH Berkeley BUV microfield exposu...
Operating as a SEMATECH resist test center, the Berkeley 0.3-NA EUV microfield exposure tool continu...
Microfield exposure tools (METs) continue to play a dominant role in the development of extreme ultr...
The resolution limit of present 0.3 NA 13.5 nm wavelength micro-exposure tools is compared to next g...
Microfield exposure tools (METs) continue to playa dominant role in the development of extreme ultra...
Microfield exposure tools (METs) play a crucial role in the development of extreme ultraviolet (EUV)...
Extreme ultraviolet (EUV) lithography is under development for possible deployment at the 32-nm tech...
A 0.5-NA extreme ultraviolet micro-field exposure tool has been installed and commissioned at beamli...
Although tremendous progress has been made in the crucial area of fabrication of extreme ultraviolet...
A 0.5-NA extreme ultraviolet micro-field exposure tool has been installed and commissioned at beamli...
The level of flare present in a 0.3-NA EUV optic (the MET optic) at the Advanced Light Source at Law...
One of the major challenges facing the commercialization of extreme ultraviolet (EUV) lithography re...