The etch rate of InP in solutions of high HCl concentration was shown to be independent of the applied potential ina wide potential range negative with respect to the flatband value. Dissolution of the solid led to the formation of PH3.The etch rate, which was not mass-transport controlled, was first order in molecular HCl concentration. The results leadus to conclude that, in HCl etchants, InP is dissolved by a purely chemical mechanism. The influence of chemical etchingon the anodic behavior of InP in these electrolytes is describe
A dry-etch process for InP is developed using a mixture of Cl2, Ar, CH4, and H2. This process result...
A dry-etch process for InP is developed using a mixture of Cl2, Ar, CH4, and H2. This process result...
A dry-etch process for InP is developed using a mixture of Cl2, Ar, CH4, and H2. This process result...
The etch rate of InP in solutions of high HCl concentration was shown to be independent of the appli...
The etch rate of InP in solutions of high HCl concentration was shown to be independent of the appli...
The etch rate of InP in solutions of high HCl concentration was shown to be independent of the appli...
The etch rate of InP in solutions of high HCl concentration was shown to be independent of the appli...
Chemical etching of InP with HCl is used on a large scale, but limited information is available in t...
International audienceThe electrochemical porous etching of n-InP in 1 M HCl has been investigated b...
International audienceThe electrochemical porous etching of n-InP in 1 M HCl has been investigated b...
International audienceThe electrochemical porous etching of n-InP in 1 M HCl has been investigated b...
International audienceThe electrochemical porous etching of n-InP in 1 M HCl has been investigated b...
International audienceThe electrochemical porous etching of n-InP in 1 M HCl has been investigated b...
A dry-etch process for InP is developed using a mixture of Cl2, Ar, CH4, and H2. This process result...
A dry-etch process for InP is developed using a mixture of Cl2, Ar, CH4, and H2. This process result...
A dry-etch process for InP is developed using a mixture of Cl2, Ar, CH4, and H2. This process result...
A dry-etch process for InP is developed using a mixture of Cl2, Ar, CH4, and H2. This process result...
A dry-etch process for InP is developed using a mixture of Cl2, Ar, CH4, and H2. This process result...
The etch rate of InP in solutions of high HCl concentration was shown to be independent of the appli...
The etch rate of InP in solutions of high HCl concentration was shown to be independent of the appli...
The etch rate of InP in solutions of high HCl concentration was shown to be independent of the appli...
The etch rate of InP in solutions of high HCl concentration was shown to be independent of the appli...
Chemical etching of InP with HCl is used on a large scale, but limited information is available in t...
International audienceThe electrochemical porous etching of n-InP in 1 M HCl has been investigated b...
International audienceThe electrochemical porous etching of n-InP in 1 M HCl has been investigated b...
International audienceThe electrochemical porous etching of n-InP in 1 M HCl has been investigated b...
International audienceThe electrochemical porous etching of n-InP in 1 M HCl has been investigated b...
International audienceThe electrochemical porous etching of n-InP in 1 M HCl has been investigated b...
A dry-etch process for InP is developed using a mixture of Cl2, Ar, CH4, and H2. This process result...
A dry-etch process for InP is developed using a mixture of Cl2, Ar, CH4, and H2. This process result...
A dry-etch process for InP is developed using a mixture of Cl2, Ar, CH4, and H2. This process result...
A dry-etch process for InP is developed using a mixture of Cl2, Ar, CH4, and H2. This process result...
A dry-etch process for InP is developed using a mixture of Cl2, Ar, CH4, and H2. This process result...