Add to ORKG!Introduction & Heterointegration !System Integration on Wafer Level !Chip Scale Packaging, 3-D integration, bumping, Integration of Passives, MEMS !System Integration on Board and Flexibel Substrates !Chip in Polymer, High Density (Flex) Interconnect !Polytronic, cost-efficient Systemintegration on Flexible Substrates
Advanced packaging technologies open new perspectives for system designers. Fan-in/out wafer level p...
Radio frequency systems have been applied successfully to consumer products. Typically these radios ...
Printed circuit boards (PCBs) have been the basis for all electronic applications of the past and wi...
Microelectronic packaging and system integration is of main relevance for new application areas e. g...
System integration technology requires multi-functionality and in many cases energy autarkic systems...
System integration technology requires multifunctionality and in many cases energy autarkic systems,...
Developing demands and the market show two main trends helping to shape the ongoing development of s...
As mobile portable devices such as cellular system/phones, smart handheld devices and laptop compute...
Developing demands and the market show two main trends helping to shape the ongoing development of s...
Heterogeneous integration of different devices by using 3D architectures allows the realization of a...
As mobile portable devices such as cellular system/phones, smart handheld devices and laptop compute...
As microsystems continue to move towards higher speed and microminiaturization, the demands for inte...
Decreasing the bill of materials for an electronic device saves development time, money and space. T...
This book presents a step-by-step discussion of the 3D integration approach for the development of c...
Future generations of electronic products require further developments of integration and packaging ...
Advanced packaging technologies open new perspectives for system designers. Fan-in/out wafer level p...
Radio frequency systems have been applied successfully to consumer products. Typically these radios ...
Printed circuit boards (PCBs) have been the basis for all electronic applications of the past and wi...
Microelectronic packaging and system integration is of main relevance for new application areas e. g...
System integration technology requires multi-functionality and in many cases energy autarkic systems...
System integration technology requires multifunctionality and in many cases energy autarkic systems,...
Developing demands and the market show two main trends helping to shape the ongoing development of s...
As mobile portable devices such as cellular system/phones, smart handheld devices and laptop compute...
Developing demands and the market show two main trends helping to shape the ongoing development of s...
Heterogeneous integration of different devices by using 3D architectures allows the realization of a...
As mobile portable devices such as cellular system/phones, smart handheld devices and laptop compute...
As microsystems continue to move towards higher speed and microminiaturization, the demands for inte...
Decreasing the bill of materials for an electronic device saves development time, money and space. T...
This book presents a step-by-step discussion of the 3D integration approach for the development of c...
Future generations of electronic products require further developments of integration and packaging ...
Advanced packaging technologies open new perspectives for system designers. Fan-in/out wafer level p...
Radio frequency systems have been applied successfully to consumer products. Typically these radios ...
Printed circuit boards (PCBs) have been the basis for all electronic applications of the past and wi...