Im Rahmen dieser Arbeit wird die Reaktion von drei verschiedenen halbleitenden Kupferoxiden (CuO, Cu4O3 und Cu2O) mit gasförmigen Schwefelwasserstoff (H2S) zu metallisch leitendem Covellin (CuS) untersucht. Dazu sind Proben mittels thermischer Oxidation von Kupfer-Dünnschichten, Sputterdeposition, Elektrospinning und Imprägnierung von Silica-Nanofasern hergestellt worden. Während des Angebotes von gasförmigen H2S bei 160°C bis 180°C Probentemperatur weist der elektrische Leitwert in Abhängigkeit von der Zeit Bereiche mit unterschiedlicher Kinetik auf. Diese sind jeweils durch chemische Reaktivität, Perkolation und Diffusion dominiert. Die Bereiche können je nach Probe durch Zwischenregionen separiert sein oder sich überlagern. Neben der Mes...
The most common additives in copper plating baths for deep via filling are chloride, polyethylene gl...
Copper oxide (Cu2O, Cu4O3 and CuO) thin films have been deposited on unmatched substrates by sputter...
Gegenstand dieser Arbeit ist das Wachstum von dünnen CuInS2-Schichten mittels eines schnellen thermi...
The corrosion of copper by atmospheric pollutants is a problem of continuing interest to the electro...
Mit dem Ziel kostengünstige, nachhaltige, umweltfreundliche und somit massentaugliche Materialien fü...
Throughout the last three decades cuprous (Cu2O) and cupric oxide (CuO) have been subject of extensi...
The reduction of copper sulphide and copper oxides originated during artificial tarnishing of copper...
International audienceMany nanoparticles (NPs) are transformed in the environment, and the propertie...
The precise detection of the toxic gas H2S requires reliable sensitivity and specificity of sensors ...
Hydrocarbon streams derived from natural gas and petroleum processing contain high concentrations of...
CU-SiO2 films were prepared by the sol-gel method. Two-dimensional fractal copper films were formed ...
Kupferleitbahnen werden in höchstintegrierten Schaltkreisen aufgrund des niedrigen spezifischen Wide...
Detailed experiments involving extensive high resolution transmission electron microscopy (TEM) reve...
The anodic dissolution of copper was examined in deaerated, 0.1 M HCl aqueous solution in the presen...
A detailed study of the oxidation of Cu substrates was carried out under controlled conditions by re...
The most common additives in copper plating baths for deep via filling are chloride, polyethylene gl...
Copper oxide (Cu2O, Cu4O3 and CuO) thin films have been deposited on unmatched substrates by sputter...
Gegenstand dieser Arbeit ist das Wachstum von dünnen CuInS2-Schichten mittels eines schnellen thermi...
The corrosion of copper by atmospheric pollutants is a problem of continuing interest to the electro...
Mit dem Ziel kostengünstige, nachhaltige, umweltfreundliche und somit massentaugliche Materialien fü...
Throughout the last three decades cuprous (Cu2O) and cupric oxide (CuO) have been subject of extensi...
The reduction of copper sulphide and copper oxides originated during artificial tarnishing of copper...
International audienceMany nanoparticles (NPs) are transformed in the environment, and the propertie...
The precise detection of the toxic gas H2S requires reliable sensitivity and specificity of sensors ...
Hydrocarbon streams derived from natural gas and petroleum processing contain high concentrations of...
CU-SiO2 films were prepared by the sol-gel method. Two-dimensional fractal copper films were formed ...
Kupferleitbahnen werden in höchstintegrierten Schaltkreisen aufgrund des niedrigen spezifischen Wide...
Detailed experiments involving extensive high resolution transmission electron microscopy (TEM) reve...
The anodic dissolution of copper was examined in deaerated, 0.1 M HCl aqueous solution in the presen...
A detailed study of the oxidation of Cu substrates was carried out under controlled conditions by re...
The most common additives in copper plating baths for deep via filling are chloride, polyethylene gl...
Copper oxide (Cu2O, Cu4O3 and CuO) thin films have been deposited on unmatched substrates by sputter...
Gegenstand dieser Arbeit ist das Wachstum von dünnen CuInS2-Schichten mittels eines schnellen thermi...