Except for MEMS working in a ultra high vacuum, the main cause of damping is the air surrounding the system. When the working pressure is equal to the atmospheric one (from now on called “high pressure,” i.e., 105 Pa), the mean free path of an air molecule is much smaller than typical MEMS dimensions. Thus, air can be considered as a viscous fluid and two phenomena occur: flow damping and squeeze film damping. These two phenomena can be evaluated through a simplified Navier–Stokes equation. In a medium vacuum (from now on called “low pressure”), i.e., the “packaging” pressure, the air cannot be considered as a viscous fluid any more since the mean free path of an air molecule is of the same order of magnitude of typical MEMS dimensions. Thu...
Evaluation of squeezed film air damping is critical in the design and control of dynamic MEMS device...
High quality factor of dynamic structures at micro and nano scale is exploited in various applicatio...
We present a novel analysis of gas damping in capacitive MEMS transducers that is based on a simple ...
Except for MEMS working in a ultra high vacuum, the main cause of damping is the air surrounding the...
Except for MEMS working in ultra high vacuum, the main cause of damping is the air surrounding the s...
Except for MEMS working in ultra high vacuum, the main cause of damping is the air surrounding the s...
The mechanical modelling of MEMS requires the determination of the inertia, of the damping and of th...
The work proposes and experimentally verifies a new model for the prediction of the quality (Q) fact...
Many MEMS devices employ parallel plates for capacitive sensing and actuation. The desire to get a s...
The paper presents simulations of air damping in MEMS, including squeeze-film and viscous dissipatio...
This paper provides experimental validation of the predictions by two recent models for squeezed fil...
Recent thrust in the design of sensitive sensors and actuators have motivated many researchers to op...
Evaluation of squeezed film air damping is critical in the design and control of dynamic MEMS device...
High quality factor of dynamic structures at micro and nano scale is exploited in various applicatio...
We present a novel analysis of gas damping in capacitive MEMS transducers that is based on a simple ...
Except for MEMS working in a ultra high vacuum, the main cause of damping is the air surrounding the...
Except for MEMS working in ultra high vacuum, the main cause of damping is the air surrounding the s...
Except for MEMS working in ultra high vacuum, the main cause of damping is the air surrounding the s...
The mechanical modelling of MEMS requires the determination of the inertia, of the damping and of th...
The work proposes and experimentally verifies a new model for the prediction of the quality (Q) fact...
Many MEMS devices employ parallel plates for capacitive sensing and actuation. The desire to get a s...
The paper presents simulations of air damping in MEMS, including squeeze-film and viscous dissipatio...
This paper provides experimental validation of the predictions by two recent models for squeezed fil...
Recent thrust in the design of sensitive sensors and actuators have motivated many researchers to op...
Evaluation of squeezed film air damping is critical in the design and control of dynamic MEMS device...
High quality factor of dynamic structures at micro and nano scale is exploited in various applicatio...
We present a novel analysis of gas damping in capacitive MEMS transducers that is based on a simple ...