With the development of electronic appliances and electronic equipment towards miniaturization, lightweight and high-power density, the heat generated and accumulated by devices during high-speed operation seriously reduces the working efficiency and service life of the equipment. The key to solving this problem is to develop high-performance thermal management materials and improve the heat dissipation efficiency of the equipment. This paper mainly summarizes the research progress of polymer composites with high thermal conductivity and electrical insulation, including the thermal conductivity mechanism of composites, the factors affecting the thermal conductivity of composites, and the research status of thermally conductive and electrica...
The majority of polymers are electrical and thermal insulators. In order to create electrically acti...
This research describes the preparation of electrically and thermally conductive polymer composites....
Advancements in the semiconductor industry have lead to the miniaturization of components and increa...
Traditional insulation material is thermally insulating and has a low thermal conductivity. The mini...
With the integration and miniaturization of electronic devices, thermal management has become a cruc...
Heat dissipation becomes a critical problem because of the miniaturisation and the increase of power...
With the miniaturization and integration of electronic products, the heat dissipation efficiency of ...
Advancements in the semiconductor industry have lead to the miniaturization of components and increa...
Advancements in the semiconductor industry have lead to the miniaturization of components and increa...
The lifespan and the performance of flexible electronic devices and components are affected by the l...
The lifespan and the performance of flexible electronic devices and components are affected by the l...
xxviii, 145 sayfatable, figure : 29 cm. 1 CDABSTRACTElectronic industry is growing dramatically in t...
Equipment is labelled as energy-saving if it requires less energy during its manufacture and operati...
Thermal conductive polymer composites attract lots of research due to the continuous miniaturization...
Thermal conductive polymer composites attract lots of research due to the continuous miniaturization...
The majority of polymers are electrical and thermal insulators. In order to create electrically acti...
This research describes the preparation of electrically and thermally conductive polymer composites....
Advancements in the semiconductor industry have lead to the miniaturization of components and increa...
Traditional insulation material is thermally insulating and has a low thermal conductivity. The mini...
With the integration and miniaturization of electronic devices, thermal management has become a cruc...
Heat dissipation becomes a critical problem because of the miniaturisation and the increase of power...
With the miniaturization and integration of electronic products, the heat dissipation efficiency of ...
Advancements in the semiconductor industry have lead to the miniaturization of components and increa...
Advancements in the semiconductor industry have lead to the miniaturization of components and increa...
The lifespan and the performance of flexible electronic devices and components are affected by the l...
The lifespan and the performance of flexible electronic devices and components are affected by the l...
xxviii, 145 sayfatable, figure : 29 cm. 1 CDABSTRACTElectronic industry is growing dramatically in t...
Equipment is labelled as energy-saving if it requires less energy during its manufacture and operati...
Thermal conductive polymer composites attract lots of research due to the continuous miniaturization...
Thermal conductive polymer composites attract lots of research due to the continuous miniaturization...
The majority of polymers are electrical and thermal insulators. In order to create electrically acti...
This research describes the preparation of electrically and thermally conductive polymer composites....
Advancements in the semiconductor industry have lead to the miniaturization of components and increa...