Traditional insulation material is thermally insulating and has a low thermal conductivity. The miniaturisation and higher power of electrical devices would generate lots of heat, which have created new challenges to safe and stable operation of the grid. The development of insulating materials with high thermal conductivity provides a new method to solve these problems. The improvement of thermal conductivity would increase the ability to conduct heat and greatly reduce the operating temperature of the electrical equipment, which could reduce the equipment size and extend service life. On the other hand, inorganic thermally conductive particles and the improved thermal conductivity may have great effect on thermal breakdown. In this study,...
The lifespan and the performance of flexible electronic devices and components are affected by the l...
The breakdown phenomena and determination of dielectric strength is one of the essential topics in t...
The lifespan and the performance of flexible electronic devices and components are affected by the l...
With the development of electronic appliances and electronic equipment towards miniaturization, ligh...
Heat dissipation becomes a critical problem because of the miniaturisation and the increase of power...
Semiconductor die attach materials for high voltage, high reliability analog devices require high th...
The performance of electrical equipment and devices is determined to a great extent by the propertie...
Composites with the epoxy matrix are still the most common composites used in high voltage electrica...
Composites with the epoxy matrix are still the most common composites used in high voltage electrica...
Epoxy resin composites filled with ceramic particles are commonly applied in electrification devices...
The research described in this thesis is part of a state-funded IOP-EMVT project in cooperation with...
Equipment is labelled as energy-saving if it requires less energy during its manufacture and operati...
The present review article represents a comprehensive study on polymer micro/nanocomposites that are...
With the advent of nano-particle fillers in insulating materials, the insulating materials of superi...
The research described in this thesis is part of a state-funded IOP-EMVT project in cooperation with...
The lifespan and the performance of flexible electronic devices and components are affected by the l...
The breakdown phenomena and determination of dielectric strength is one of the essential topics in t...
The lifespan and the performance of flexible electronic devices and components are affected by the l...
With the development of electronic appliances and electronic equipment towards miniaturization, ligh...
Heat dissipation becomes a critical problem because of the miniaturisation and the increase of power...
Semiconductor die attach materials for high voltage, high reliability analog devices require high th...
The performance of electrical equipment and devices is determined to a great extent by the propertie...
Composites with the epoxy matrix are still the most common composites used in high voltage electrica...
Composites with the epoxy matrix are still the most common composites used in high voltage electrica...
Epoxy resin composites filled with ceramic particles are commonly applied in electrification devices...
The research described in this thesis is part of a state-funded IOP-EMVT project in cooperation with...
Equipment is labelled as energy-saving if it requires less energy during its manufacture and operati...
The present review article represents a comprehensive study on polymer micro/nanocomposites that are...
With the advent of nano-particle fillers in insulating materials, the insulating materials of superi...
The research described in this thesis is part of a state-funded IOP-EMVT project in cooperation with...
The lifespan and the performance of flexible electronic devices and components are affected by the l...
The breakdown phenomena and determination of dielectric strength is one of the essential topics in t...
The lifespan and the performance of flexible electronic devices and components are affected by the l...