The SiO2 layer was deposited on the 4H-SiC Si face by the thermal decomposition of tetraethylorthosilicate(TEOS) in N2 atmosphere to from MIS diodes. The post deposition annealing was effective to improve the interface properties. The interface state density of the deposited SiO2/SiC MIS structure was estimated to be the order of 1011 cm-2eV-1 by Terman method. The direct nitridation of SiC surface prior to the deposition of the SiO2 layer was effective to reduce the interface state density.ArticleMaterials Science Forum, Vols. 740-742, pp. 805-808 (2013)journal articl
SiC has immense potential as the semiconductor for future metal–oxide–semiconductor (MOS) devices. O...
Interface state density was estimated from diode factor n of SiC MIS Schottky diode. The interface s...
Normally-on MOSFETs were fabricated on 3C-SiC epilayers using high temperature (1300 °C) wet oxidati...
The SiO2 layer was deposited on the 4H-SiC Si face by the thermal decomposition of tetraethylorthosi...
An alternative and effective method to perform interface nitridation for 4H-SiC metal-oxide-semicond...
A nitride layer was formed on a SiC surface by plasma nitridation using pure nitrogen as the reactio...
An alternative and effective method to perform interface nitridation for 4H-SiC metal-oxide-semicond...
Silicon carbide (SiC) is the only wide-bandgap semiconductor capable of forming native dielectric la...
逆転の発想でSiCパワー半導体の高品質化に成功 --非酸化による酸化膜形成で高品質化10倍--. 京都大学プレスリリース. 2020-08-24.We report an effective appr...
This thesis aims to optimize the process for the 4H-SiC/SiO2 interface formations. The experiments a...
This thesis aims to optimize the process for the 4H-SiC/SiO2 interface formations. The experiments a...
This thesis aims to optimize the process for the 4H-SiC/SiO2 interface formations. The experiments a...
Interface state density was estimated from diode factor n of SiC MIS Schottky diode. The interface s...
This paper describes the thermal oxidation of Si/SiC heterojunction structures, produced using a lay...
Consultable des del TDXTítol obtingut de la portada digitalitzadaThere is considerable evidence of t...
SiC has immense potential as the semiconductor for future metal–oxide–semiconductor (MOS) devices. O...
Interface state density was estimated from diode factor n of SiC MIS Schottky diode. The interface s...
Normally-on MOSFETs were fabricated on 3C-SiC epilayers using high temperature (1300 °C) wet oxidati...
The SiO2 layer was deposited on the 4H-SiC Si face by the thermal decomposition of tetraethylorthosi...
An alternative and effective method to perform interface nitridation for 4H-SiC metal-oxide-semicond...
A nitride layer was formed on a SiC surface by plasma nitridation using pure nitrogen as the reactio...
An alternative and effective method to perform interface nitridation for 4H-SiC metal-oxide-semicond...
Silicon carbide (SiC) is the only wide-bandgap semiconductor capable of forming native dielectric la...
逆転の発想でSiCパワー半導体の高品質化に成功 --非酸化による酸化膜形成で高品質化10倍--. 京都大学プレスリリース. 2020-08-24.We report an effective appr...
This thesis aims to optimize the process for the 4H-SiC/SiO2 interface formations. The experiments a...
This thesis aims to optimize the process for the 4H-SiC/SiO2 interface formations. The experiments a...
This thesis aims to optimize the process for the 4H-SiC/SiO2 interface formations. The experiments a...
Interface state density was estimated from diode factor n of SiC MIS Schottky diode. The interface s...
This paper describes the thermal oxidation of Si/SiC heterojunction structures, produced using a lay...
Consultable des del TDXTítol obtingut de la portada digitalitzadaThere is considerable evidence of t...
SiC has immense potential as the semiconductor for future metal–oxide–semiconductor (MOS) devices. O...
Interface state density was estimated from diode factor n of SiC MIS Schottky diode. The interface s...
Normally-on MOSFETs were fabricated on 3C-SiC epilayers using high temperature (1300 °C) wet oxidati...