Interface state density was estimated from diode factor n of SiC MIS Schottky diode. The interface state density was the order of 10(12) cm(-2)eV(-1), and was same order to the value for the sample carefully prepared by oxidation and post oxidation annealing. The interface state density determined from n was consistent to the value calculated from the capacitance voltage curve of SiO(2)/nitride/SiC MIS diode by Terman method. High temperature nitridation was effective to reduce the interface state density.ArticleIEICE TRANSACTIONS ON ELECTRONICS. E92C(12):1470-1474 (2009)journal articl
The electrical properties of dry-oxidized, N2O-annealed n-type 6H-SiC metal-oxide-semiconductor (MOS...
The electrical compensation effect of the nitrogen incorporation at the SiO2/4H-SiC (p-type) interfa...
A nitride layer was formed on a SiC surface by plasma nitridation using pure nitrogen as the reactio...
Interface state density was estimated from diode factor n of SiC MIS Schottky diode. The interface s...
The SiO2 layer was deposited on the 4H-SiC Si face by the thermal decomposition of tetraethylorthosi...
The SiO2 layer was deposited on the 4H-SiC Si face by the thermal decomposition of tetraethylorthosi...
The need for an alternative to the prevailing Si based semiconductor devices is ever present, since ...
Dry-oxidized and N2O-annealed n-type 6H-SiC metal-oxide-semiconductor capacitors are investigated at...
We found that post-oxidation Ar annealing at high temperature is effective in reducing the interface...
An alternative and effective method to perform interface nitridation for 4H-SiC metal-oxide-semicond...
Fast states at SiO[2]/SiC interfacesannealed in NO at 1150–1350 °C have been investigated. The respo...
SiC has immense potential as the semiconductor for future metal–oxide–semiconductor (MOS) devices. O...
Results are reported for the passivation of interface states near the conduction band edge in SiO{su...
An alternative and effective method to perform interface nitridation for 4H-SiC metal-oxide-semicond...
Silicon carbide (SiC) is the only wide-bandgap semiconductor capable of forming native dielectric la...
The electrical properties of dry-oxidized, N2O-annealed n-type 6H-SiC metal-oxide-semiconductor (MOS...
The electrical compensation effect of the nitrogen incorporation at the SiO2/4H-SiC (p-type) interfa...
A nitride layer was formed on a SiC surface by plasma nitridation using pure nitrogen as the reactio...
Interface state density was estimated from diode factor n of SiC MIS Schottky diode. The interface s...
The SiO2 layer was deposited on the 4H-SiC Si face by the thermal decomposition of tetraethylorthosi...
The SiO2 layer was deposited on the 4H-SiC Si face by the thermal decomposition of tetraethylorthosi...
The need for an alternative to the prevailing Si based semiconductor devices is ever present, since ...
Dry-oxidized and N2O-annealed n-type 6H-SiC metal-oxide-semiconductor capacitors are investigated at...
We found that post-oxidation Ar annealing at high temperature is effective in reducing the interface...
An alternative and effective method to perform interface nitridation for 4H-SiC metal-oxide-semicond...
Fast states at SiO[2]/SiC interfacesannealed in NO at 1150–1350 °C have been investigated. The respo...
SiC has immense potential as the semiconductor for future metal–oxide–semiconductor (MOS) devices. O...
Results are reported for the passivation of interface states near the conduction band edge in SiO{su...
An alternative and effective method to perform interface nitridation for 4H-SiC metal-oxide-semicond...
Silicon carbide (SiC) is the only wide-bandgap semiconductor capable of forming native dielectric la...
The electrical properties of dry-oxidized, N2O-annealed n-type 6H-SiC metal-oxide-semiconductor (MOS...
The electrical compensation effect of the nitrogen incorporation at the SiO2/4H-SiC (p-type) interfa...
A nitride layer was formed on a SiC surface by plasma nitridation using pure nitrogen as the reactio...