Fin heat sinks are the most widely used type of heat sink for cooling purposes nowadays where space is a key factor, such as for the cooling of electronic equipment. Improved cooling capacity and the lowest possible thermal resistance in the design optimization process of these sink geometries means that we should consider a number of variable parameters, which can involve tedious design processes that are almost impossible to approximate to a sufficient degree of accuracy without computer simulation tools. The principal parameters are the heat dissipation base area, fin size, shape and material and the heat transfer coefficient. Computer numerical simulation tools greatly assist the design process, allowing in turn a greater range and more...
A mathematical model of the process occurring on fin at same height and different height with differ...
The effect of the pin-fin shapes on the overall performance of the heat sink with inline and stagger...
A mathematical model of the process occurring on fin at same height and different height with differ...
[[abstract]]An effective method for performing the thermal optimization of fully confined pin-fin he...
The effect of the pin-fin shapes on the overall performance of the heat sink with inline and stagger...
Advancement in electronic systems resulted in miniaturization and high-power densities. Therefore, t...
Advancement in electronic systems resulted in miniaturization and high-power densities. Therefore, t...
Advancement in electronic systems resulted in miniaturization and high-power densities. Therefore, t...
Advancement in electronic systems resulted in miniaturization and high-power densities. Therefore, t...
Advancement in electronic systems resulted in miniaturization and high-power densities. Therefore, t...
Advancement in electronic systems resulted in miniaturization and high-power densities. Therefore, t...
Plate Fin Heat Sinks (PFHS) are among the simplest and most widespread devices for electronics cooli...
Heat sinks are commonly used for the dissipation of heat in microelectronics packages. The choice o...
In recent decades peoples are moving towards high power density and smaller package size especially ...
The drastic technological growth and development of advanced computer processors leads to a serious ...
A mathematical model of the process occurring on fin at same height and different height with differ...
The effect of the pin-fin shapes on the overall performance of the heat sink with inline and stagger...
A mathematical model of the process occurring on fin at same height and different height with differ...
[[abstract]]An effective method for performing the thermal optimization of fully confined pin-fin he...
The effect of the pin-fin shapes on the overall performance of the heat sink with inline and stagger...
Advancement in electronic systems resulted in miniaturization and high-power densities. Therefore, t...
Advancement in electronic systems resulted in miniaturization and high-power densities. Therefore, t...
Advancement in electronic systems resulted in miniaturization and high-power densities. Therefore, t...
Advancement in electronic systems resulted in miniaturization and high-power densities. Therefore, t...
Advancement in electronic systems resulted in miniaturization and high-power densities. Therefore, t...
Advancement in electronic systems resulted in miniaturization and high-power densities. Therefore, t...
Plate Fin Heat Sinks (PFHS) are among the simplest and most widespread devices for electronics cooli...
Heat sinks are commonly used for the dissipation of heat in microelectronics packages. The choice o...
In recent decades peoples are moving towards high power density and smaller package size especially ...
The drastic technological growth and development of advanced computer processors leads to a serious ...
A mathematical model of the process occurring on fin at same height and different height with differ...
The effect of the pin-fin shapes on the overall performance of the heat sink with inline and stagger...
A mathematical model of the process occurring on fin at same height and different height with differ...