The effect of the pin-fin shapes on the overall performance of the heat sink with inline and staggered arrangement is studied in this paper. Six different shapes of fins rectangle, trapezoidal, rectangular interrupted, square, circular inline and staggered are subjected to study in this paper. The optimization processes are carried out using computer simulations performed using Ansys workbench 14.0. TheHeat transfer taken in natural air and aluminum 6063 as a pin fin material. To study of thermal performance of different heat sink of the different fin profile at different velocities 5, 10 & 12 m/s and simulation is done at different heat load of 15W, 20W & 25 W and air inlet temperature is taken as 295 K. The purpose of this study is to ex...
ABSTRACT: The power density of electronic devices has been increasing along with the rapid technolog...
In this paper Thermal, CFD analysis is conducted on the rectangular fin arrays by natural convection...
The official published version of this article can be found at the link below.This paper provides a ...
The effect of the pin-fin shapes on the overall performance of the heat sink with inline and stagger...
Heat sinks are commonly used for the dissipation of heat in microelectronics packages. The choice o...
Advancement in electronic systems resulted in miniaturization and high-power densities. Therefore, t...
Advancement in electronic systems resulted in miniaturization and high-power densities. Therefore, t...
Advancement in electronic systems resulted in miniaturization and high-power densities. Therefore, t...
Advancement in electronic systems resulted in miniaturization and high-power densities. Therefore, t...
Advancement in electronic systems resulted in miniaturization and high-power densities. Therefore, t...
Advancement in electronic systems resulted in miniaturization and high-power densities. Therefore, t...
The usage of the electronic goods has been increased tremendously; hence it is the challenging task ...
The advancement of microelectronics technology in producing high clock speed and power density’s cen...
[[abstract]]An effective method for performing the thermal optimization of fully confined pin-fin he...
The drastic technological growth and development of advanced computer processors leads to a serious ...
ABSTRACT: The power density of electronic devices has been increasing along with the rapid technolog...
In this paper Thermal, CFD analysis is conducted on the rectangular fin arrays by natural convection...
The official published version of this article can be found at the link below.This paper provides a ...
The effect of the pin-fin shapes on the overall performance of the heat sink with inline and stagger...
Heat sinks are commonly used for the dissipation of heat in microelectronics packages. The choice o...
Advancement in electronic systems resulted in miniaturization and high-power densities. Therefore, t...
Advancement in electronic systems resulted in miniaturization and high-power densities. Therefore, t...
Advancement in electronic systems resulted in miniaturization and high-power densities. Therefore, t...
Advancement in electronic systems resulted in miniaturization and high-power densities. Therefore, t...
Advancement in electronic systems resulted in miniaturization and high-power densities. Therefore, t...
Advancement in electronic systems resulted in miniaturization and high-power densities. Therefore, t...
The usage of the electronic goods has been increased tremendously; hence it is the challenging task ...
The advancement of microelectronics technology in producing high clock speed and power density’s cen...
[[abstract]]An effective method for performing the thermal optimization of fully confined pin-fin he...
The drastic technological growth and development of advanced computer processors leads to a serious ...
ABSTRACT: The power density of electronic devices has been increasing along with the rapid technolog...
In this paper Thermal, CFD analysis is conducted on the rectangular fin arrays by natural convection...
The official published version of this article can be found at the link below.This paper provides a ...