We report a simple and efficient algorithm to calculate the growth of damage in Si within the framework of a recently developed Monte Carlo code for the simulation of ion implantation in crystals. We let the defects created by the incoming ions interact, during the simulation, with the damage previously accumulated. We assume this dynamical interaction to depend both on defect generation density and concentration of pre-existing damage. Preliminary comparison of calculations with experimental data in the case of Si samples implanted with 700 keV N+ ions shows that this scheme can well reproduce the observed non-linearities in the growth behavior
The amorphization of silicon due to atomic displacement during ion implantation has been simulated. ...
Atomistic modeling has been applied in studying and simulating the advanced junction technologies. W...
We review our recent work on an atomistic approach to the development of predictive process simulati...
We report a simple and efficient algorithm to calculate the growth of damage in Si within the framew...
Classical molecular dynamics simulations are used to study damage produced during implantation of se...
A new damage model for ion implantation simulation based on molecular dynamic method is introduced i...
We combine molecular dynamics and Monte Carlo simulations to study damage accumulation and dose rate...
[[abstract]]Ion implantation is the key processing step in the production of integrated circuits. Ho...
A new understanding of the damage formation mechanisms in Si is developed and investigated over an e...
A new damage model for ion implantation simulation based on molecular dynamic method is introduced i...
We review the development and application of kinetic Monte Carlo simulations to investigate defect a...
Defects evolution in silicon during annealing after low energy Si+ implantation is simulated by atom...
We present results of multiple-time-scale simulations of 5, 10 and 15 keV low temperature ion implan...
The process of damage accumulation in In implanted Si by transmission electron microscopy (XTEM) and...
Atomistic modeling has been applied in studying and simulating the advanced junction technologies. W...
The amorphization of silicon due to atomic displacement during ion implantation has been simulated. ...
Atomistic modeling has been applied in studying and simulating the advanced junction technologies. W...
We review our recent work on an atomistic approach to the development of predictive process simulati...
We report a simple and efficient algorithm to calculate the growth of damage in Si within the framew...
Classical molecular dynamics simulations are used to study damage produced during implantation of se...
A new damage model for ion implantation simulation based on molecular dynamic method is introduced i...
We combine molecular dynamics and Monte Carlo simulations to study damage accumulation and dose rate...
[[abstract]]Ion implantation is the key processing step in the production of integrated circuits. Ho...
A new understanding of the damage formation mechanisms in Si is developed and investigated over an e...
A new damage model for ion implantation simulation based on molecular dynamic method is introduced i...
We review the development and application of kinetic Monte Carlo simulations to investigate defect a...
Defects evolution in silicon during annealing after low energy Si+ implantation is simulated by atom...
We present results of multiple-time-scale simulations of 5, 10 and 15 keV low temperature ion implan...
The process of damage accumulation in In implanted Si by transmission electron microscopy (XTEM) and...
Atomistic modeling has been applied in studying and simulating the advanced junction technologies. W...
The amorphization of silicon due to atomic displacement during ion implantation has been simulated. ...
Atomistic modeling has been applied in studying and simulating the advanced junction technologies. W...
We review our recent work on an atomistic approach to the development of predictive process simulati...