In this work, the grain-boundary cavitation in polycrystalline aggregates is investigated by means of a grain-scale model. Polycrystalline aggregates are generated using Voronoi tessellations, which have been extensively shown to retain the statistical features of real microstructures. Nucleation, thickening and sliding of cavities at grain boundaries are represented by specific cohesive laws embodying the damage parameters, whose time evolution equations are coupled to the mechanical model. The formulation is presented within the framework of a grainboundary formulation, which only requires the discretization of the grain surfaces. Some numerical tests are presented to demonstrate the feasibility of the method
A 3D grain boundary formulation is presented for the analysis of polycrystalline microstructures. Th...
This paper deals with a study of intergranular failure by creep cavitation under stress-controlled c...
A 3D grain-level formulation for the study of brittle failure in polycrystalline microstructures is...
In this work, the grain-boundary cavitation in polycrystalline aggregates is investigated by means o...
In polycrystalline materials at elevated temperatures subjected to stationary loading, creep fractur...
This paper is concerned with a micromechanical investigation of intergranular creep failure caused b...
A new computational model is presented to analyze intergranular creep crack growth in a polycrystall...
Abstract-This paper is concerned with a micromechanical investigation of intergranular creep failure...
A plane strain unit cell model containing a periodic array of hexagonal grains is used to analyse cr...
In this paper, the effect of pre-existing damage on brittle micro-cracking of polycrystalline materi...
Computational modeling techniques are now widely employed in material science, mainly due to recent ...
A new numerical method is proposed to simulate intergranular c eep fracture in large polycrystalline...
Magdeburg, Univ., Fak. für Maschinenbau, Diss., 2014von Oksana Ozhoga-Maslovskaj
AbstractA micromechanical model of creep induced grain boundary damage is proposed, which allows for...
Abstract-Following concepts introduced by B. F. Dyson (Metal Sci. 349 19761, the dilTusive cavitatio...
A 3D grain boundary formulation is presented for the analysis of polycrystalline microstructures. Th...
This paper deals with a study of intergranular failure by creep cavitation under stress-controlled c...
A 3D grain-level formulation for the study of brittle failure in polycrystalline microstructures is...
In this work, the grain-boundary cavitation in polycrystalline aggregates is investigated by means o...
In polycrystalline materials at elevated temperatures subjected to stationary loading, creep fractur...
This paper is concerned with a micromechanical investigation of intergranular creep failure caused b...
A new computational model is presented to analyze intergranular creep crack growth in a polycrystall...
Abstract-This paper is concerned with a micromechanical investigation of intergranular creep failure...
A plane strain unit cell model containing a periodic array of hexagonal grains is used to analyse cr...
In this paper, the effect of pre-existing damage on brittle micro-cracking of polycrystalline materi...
Computational modeling techniques are now widely employed in material science, mainly due to recent ...
A new numerical method is proposed to simulate intergranular c eep fracture in large polycrystalline...
Magdeburg, Univ., Fak. für Maschinenbau, Diss., 2014von Oksana Ozhoga-Maslovskaj
AbstractA micromechanical model of creep induced grain boundary damage is proposed, which allows for...
Abstract-Following concepts introduced by B. F. Dyson (Metal Sci. 349 19761, the dilTusive cavitatio...
A 3D grain boundary formulation is presented for the analysis of polycrystalline microstructures. Th...
This paper deals with a study of intergranular failure by creep cavitation under stress-controlled c...
A 3D grain-level formulation for the study of brittle failure in polycrystalline microstructures is...