The intrinsic ability of solid materials to conduct heat is called thermal conductivity (and here is denoted by the symbol κ). It is essential to control the thermal conductivity in functional materials wherever heat transfer plays a key role, such as in thermoelectric devices, thermal interface materials for heat management in electronics, biomedical implants and personal protective equipment. Techniques are needed to tailor the thermal conductivity for specific applications. For example, thermoelectric devices require lower thermal conductivity to maximise their efficiency. Such devices offer a way to capture approximately 60-70% of the energy that is converted into unused heat as a secondary by-product of many technological and industr...
One significant challenge in the development of micro- and nano-electronic devices is thermal manage...
ABSTRACT Continued advances in nanostructured materials have made it necessary to develop materials ...
The developed model for thermal conductivity of nanofluids integrates the interfacial Kapitza resist...
The intrinsic ability of solid materials to conduct heat is called thermal conductivity (and here is...
In conclusion, the analysis and measurement of thermal properties are crucial for a wide range of ap...
Thesis advisor: Cyril P. OpeilThermoelectric (TE) materials are of broad interest for alternate ener...
Active control of thermal transport is of significant interest for a wide range of applications, suc...
As electronic devices become smaller in size, thermal management challenge for various applications ...
Thermal conductivity (k) plays an essential role in functional devices. In some cases, high value is...
Thermal conductivity(k) is an important property of a material which is critical for applications in...
Due to increasing average global temperatures, the energy used for space cooling in buildings will i...
The enormous amount of waste heat from different sources for instance: exhaust system of automobiles...
This thesis is structured into five main chapters, as well as the introduction, literature review, an...
This paper was presented at the 4th Micro and Nano Flows Conference (MNF2014), which was held at Uni...
One significant challenge in the development of micro- and nano-electronic devices is thermal manage...
One significant challenge in the development of micro- and nano-electronic devices is thermal manage...
ABSTRACT Continued advances in nanostructured materials have made it necessary to develop materials ...
The developed model for thermal conductivity of nanofluids integrates the interfacial Kapitza resist...
The intrinsic ability of solid materials to conduct heat is called thermal conductivity (and here is...
In conclusion, the analysis and measurement of thermal properties are crucial for a wide range of ap...
Thesis advisor: Cyril P. OpeilThermoelectric (TE) materials are of broad interest for alternate ener...
Active control of thermal transport is of significant interest for a wide range of applications, suc...
As electronic devices become smaller in size, thermal management challenge for various applications ...
Thermal conductivity (k) plays an essential role in functional devices. In some cases, high value is...
Thermal conductivity(k) is an important property of a material which is critical for applications in...
Due to increasing average global temperatures, the energy used for space cooling in buildings will i...
The enormous amount of waste heat from different sources for instance: exhaust system of automobiles...
This thesis is structured into five main chapters, as well as the introduction, literature review, an...
This paper was presented at the 4th Micro and Nano Flows Conference (MNF2014), which was held at Uni...
One significant challenge in the development of micro- and nano-electronic devices is thermal manage...
One significant challenge in the development of micro- and nano-electronic devices is thermal manage...
ABSTRACT Continued advances in nanostructured materials have made it necessary to develop materials ...
The developed model for thermal conductivity of nanofluids integrates the interfacial Kapitza resist...