Study of Lead-Free Solder Joint Reliability

Solders are essential for the construction of many engineering materials. The use of soldering in electronic packaging has become increasingly critical in today's world. In the electronic manufacturing industry, alternative soldering materials based on tin metal have developed gradually over the last two decades. Manufacturing companies are primarily concerned about removing lead from electronic manufacturing and waste recycling by switching to the lead-free solder. Environmental and human health are adversely affected by exposure to high lead levels in consumer products. The manufacturing industry has switched to lead-free soldering to support their social responsibility initiatives. The three categories of lead-free solder are classified according to temperature range: high-temperature solder, medium-temperature solder, and low-temperature solder. This research is conducted based on the approach of study literature, which is obtained from some papers that generally explain lead-free solder. To provide additional knowledge which is expected to add new insights about the importance of lead-free usage and its behavior.Solder merupakan material penting dalam banyak proses pembuatan bahan teknik. Penggunaan solder dalam proses pengemasan elektronik menjadi hal yang sangat penting di dunia saat ini. Pada industry manufaktur elektronik, bahan solder alternatif berbasis logam timah telah berkembang secara bertahap selama dua dekade terakhir. Utamanya, perusahaan manufaktur yang sangat memperhatikan terkait penggunaan timbal dalam proses penyolderan dan proses daur ulang limbah tersebut yang coba dialihkan kepada penggunaan solder bebas tima (lead-free solder). Lingkungan dan kesehatan manusia yang paling mudah mendapatkan dampak negatif dari paparan timbal tersebut. Industri manufaktur telah beralih ke penyolderan bebas timah untuk mendukung inisiatif dan tanggung jawab sosial. Tiga kategori solder bebas timah diklasifikasikan menurut kisaran temperatur: solder temperatur tinggi, solder temperatur sedang, dan solder temperatur rendah. Penelitian ini dilakukan berdasarkan pendekatan studi literatur yang diperoleh dari beberapa penelitian yang secara umum menjelaskan mengenai solder lead-free. Memberikan tambahan pengetahuan yang diharapkan dapat menambah wawasan baru mengenai pentingnya penggunaan solder bebas timbal (lead-free) serta mengenal perilakunya