International audienceIntegration of power systems will require new packaging technologies. The compactness of new structure developed is a new challenge in the converter design. New packaging technologies are investigated in order to satisfy this volume constraint. Die location and interconnect currently used nowadays avoid the design of 3D structure for power electronic systems. This paper will present several techniques and discussion will be lead. According that thermal and mechanical requirements ensure satisfying reliability, special attention will be paid on the interconnect design
This thesis is concerned with the design and implementation of a power electronic system (14/42V DC/...
High power circuits, those involving high levels of voltages and currents to produce several kilowat...
The use of Printed Circuit Board (PCB) technology for device packaging offers new opportunities to s...
The current construction technology for PCB assembled power converters is based on the assembly of p...
The current construction technology for PCB assembled power converters is based on the assembly of p...
Standard packaging and interconnection technologies of power devices have difficulties meeting the i...
The use of power electronics is growing extensively in applications such as the automotive field, li...
The design of novel solutions for packaging and integration of power semiconductor devices to delive...
The paper focuses on a new generation of power modules, trying to optimize the tradeoff between ther...
Most power electronic modules are specifically designed for the customer and this entails intense la...
This work presents the development of a highly integrated power switch, based on 70μm thin IGBTs and...
During the last decade, embedding technology has evolved from a research subject to a hot topic in p...
High power circuits, those involving high levels of voltages and currents to produce several kilowat...
This work presents a new bond-less and economic viable, technology for power dice interconnection in...
This thesis is concerned with the design and implementation of a power electronic system (14/42V DC/...
This thesis is concerned with the design and implementation of a power electronic system (14/42V DC/...
High power circuits, those involving high levels of voltages and currents to produce several kilowat...
The use of Printed Circuit Board (PCB) technology for device packaging offers new opportunities to s...
The current construction technology for PCB assembled power converters is based on the assembly of p...
The current construction technology for PCB assembled power converters is based on the assembly of p...
Standard packaging and interconnection technologies of power devices have difficulties meeting the i...
The use of power electronics is growing extensively in applications such as the automotive field, li...
The design of novel solutions for packaging and integration of power semiconductor devices to delive...
The paper focuses on a new generation of power modules, trying to optimize the tradeoff between ther...
Most power electronic modules are specifically designed for the customer and this entails intense la...
This work presents the development of a highly integrated power switch, based on 70μm thin IGBTs and...
During the last decade, embedding technology has evolved from a research subject to a hot topic in p...
High power circuits, those involving high levels of voltages and currents to produce several kilowat...
This work presents a new bond-less and economic viable, technology for power dice interconnection in...
This thesis is concerned with the design and implementation of a power electronic system (14/42V DC/...
This thesis is concerned with the design and implementation of a power electronic system (14/42V DC/...
High power circuits, those involving high levels of voltages and currents to produce several kilowat...
The use of Printed Circuit Board (PCB) technology for device packaging offers new opportunities to s...