The current construction technology for PCB assembled power converters is based on the assembly of pre-manufactured discrete components. Fundamental limits of this construction method are steadily being reached as power converters tend to exploit higher processing speeds to gain advantages in both magnetic component size and overall power density. This thesis investigates a new design approach encompassing thermal management, geometrical packaging and electromagnetic integration (focussing on the PCB in particular) to push the limits further. In the research, a quantitative means to deal with component layout and the effect it has on the temperature characteristic of the converter is introduced as design tool.It incorporates the ability to ...
The use of Printed Circuit Board (PCB) technology for device packaging offers new opportunities to s...
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer S...
International audienceThis paper presents an original 3D folded power inductor concept using Printed...
The current construction technology for PCB assembled power converters is based on the assembly of p...
A means for power electronics to exploit the level of 3-D packaging already being implemented in com...
A means for power electronics to exploit the level of 3-D packaging already being implemented in com...
The use of power electronics is growing extensively in applications such as the automotive field, li...
Current PCB power converter construction technologies are based on the utilization of nonstandardize...
International audienceThe embedding of components in Printed Circuit Board (PCB) material is an attr...
International audienceIntegration of power systems will require new packaging technologies. The comp...
The paper focuses on a new generation of power modules, trying to optimize the tradeoff between ther...
High integrated printed circuit boards (PCB) for high power applications needs new cooling concepts....
Today, the efficient management of the electrical energy relies on power electronic converters. The c...
International audiencePrinted-Circuit-Board (PCB) technology is attractive for power electronic syst...
High integrated electronic PCB boards for high power applications needs new cooling Concepts. The 3D...
The use of Printed Circuit Board (PCB) technology for device packaging offers new opportunities to s...
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer S...
International audienceThis paper presents an original 3D folded power inductor concept using Printed...
The current construction technology for PCB assembled power converters is based on the assembly of p...
A means for power electronics to exploit the level of 3-D packaging already being implemented in com...
A means for power electronics to exploit the level of 3-D packaging already being implemented in com...
The use of power electronics is growing extensively in applications such as the automotive field, li...
Current PCB power converter construction technologies are based on the utilization of nonstandardize...
International audienceThe embedding of components in Printed Circuit Board (PCB) material is an attr...
International audienceIntegration of power systems will require new packaging technologies. The comp...
The paper focuses on a new generation of power modules, trying to optimize the tradeoff between ther...
High integrated printed circuit boards (PCB) for high power applications needs new cooling concepts....
Today, the efficient management of the electrical energy relies on power electronic converters. The c...
International audiencePrinted-Circuit-Board (PCB) technology is attractive for power electronic syst...
High integrated electronic PCB boards for high power applications needs new cooling Concepts. The 3D...
The use of Printed Circuit Board (PCB) technology for device packaging offers new opportunities to s...
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer S...
International audienceThis paper presents an original 3D folded power inductor concept using Printed...