Today's Power Electronics requires semi-conductor devices with better performance, both ir static and dynamic modes. This requirements include low on-state and switching losses, higr. switching speed, high switching off capabilky, etc. MCT is one of the new devices that may be able to meet the above requirements. Thanks to its structure, which combines thyristor and MOS the MCT offers low on-state voltage and easy drive. This thesis is composed of two parts. In the first part, we présent a study of the behavior single MCTs, available today, in différent commutation modes (hard switching, ZVS, ZCS) and in the case of overload (switching off capability and RBSOA). This part of the study involves twe différent and complementary methods : the e...
A conventional Engine Control Unit (ECU) consists of two levels, called powertrain and engine levels...
The main objective of my PhD thesis is to propose and validate the principle of a new optimized simu...
Direct wafer bonding refers to a process by which two mirror-polished wafers are put into contact an...
In the past few years, the increasing demand for high quality non-volatile memory (NVM) devices, lea...
In the past few years, the increasing demand for high quality non-volatile memory (NVM) devices, lea...
The central topic of this work is the study of the properties and the implementation of a Paul trap ...
Electromagnetic material characterization is constantly increasing due to many industrial applicatio...
Les GTPases de la sous famille RHOA participent à la régulation de nombreuses voies de signalisation...
The aim of this study was to discover whether the working of a micro-organization such as a teaching...
L'objectif de la thèse est la réalisation d'un simulateur de circuits électrotechniques et réseaux é...
A conventional Engine Control Unit (ECU) consists of two levels, called powertrain and engine levels...
Suzy Collin PrésidenteEstelle Asséo RapporteurAttilio Ferrari RapporteurJean Heayvaerts ExaminateurG...
Les antennes reconfigurables offrent de multiples fonctions en changeant dynamiquement leurs proprié...
Technological roadmap of the microelectronic industry is mainly described by Moore'slaw which aims a...
Direct wafer bonding refers to a process by which two mirror-polished wafers are put into contact an...
A conventional Engine Control Unit (ECU) consists of two levels, called powertrain and engine levels...
The main objective of my PhD thesis is to propose and validate the principle of a new optimized simu...
Direct wafer bonding refers to a process by which two mirror-polished wafers are put into contact an...
In the past few years, the increasing demand for high quality non-volatile memory (NVM) devices, lea...
In the past few years, the increasing demand for high quality non-volatile memory (NVM) devices, lea...
The central topic of this work is the study of the properties and the implementation of a Paul trap ...
Electromagnetic material characterization is constantly increasing due to many industrial applicatio...
Les GTPases de la sous famille RHOA participent à la régulation de nombreuses voies de signalisation...
The aim of this study was to discover whether the working of a micro-organization such as a teaching...
L'objectif de la thèse est la réalisation d'un simulateur de circuits électrotechniques et réseaux é...
A conventional Engine Control Unit (ECU) consists of two levels, called powertrain and engine levels...
Suzy Collin PrésidenteEstelle Asséo RapporteurAttilio Ferrari RapporteurJean Heayvaerts ExaminateurG...
Les antennes reconfigurables offrent de multiples fonctions en changeant dynamiquement leurs proprié...
Technological roadmap of the microelectronic industry is mainly described by Moore'slaw which aims a...
Direct wafer bonding refers to a process by which two mirror-polished wafers are put into contact an...
A conventional Engine Control Unit (ECU) consists of two levels, called powertrain and engine levels...
The main objective of my PhD thesis is to propose and validate the principle of a new optimized simu...
Direct wafer bonding refers to a process by which two mirror-polished wafers are put into contact an...