textThe 2005 International Technology Roadmap for Semiconductors predicts ultrashallow junctions (USJs) less than 7 nm deep with unprecedented dopant activation levels will be required for silicon transistors to be manufactured in 2010. To meet these requirements, it is necessary to have a better understanding of the dopant transient enhanced diffusion (TED) and clustering behaviors that undermine the achievement of these manufacturing specifications. Arsenic (As) is a commonly used n-type dopant in USJ formation and fluorine (F) is an impurity commonly co-implanted with dopants to reduce dopant diffusion and clustering during USJ formation. In this dissertation, density functional theory within the generalized gradient approximation is ...
Fluorine is known to have a beneficial role for the B diffusion reduction in preamorphized Si, and i...
The transient enhanced diffusion of acceptor impurities severely affects the realization of ultrahig...
The transient enhanced diffusion (TED) of As in silicon samples implanted at 35 keV with dose 5*1015...
textThe 2005 International Technology Roadmap for Semiconductors predicts ultrashallow junctions (US...
textAs the size of modern transistors is continuously scaled down, challenges rise in almost every c...
textAs the size of modern transistors is continuously scaled down, challenges rise in almost every c...
The understanding of the behavior of arsenic in highly doped near surface silicon layers is of cruci...
The effects of an additional fluorine ion implantation i to highly doped n-type silicon were studied...
While it is known that F modifies dopant diffusion in crystalline Si, the physical mechanisms behind...
The transient enhanced diffusion of acceptor impurities severely affects the realization of ultrahig...
The transient enhanced diffusion of acceptor impurities severely affects the realization of ultrahig...
The behavior during annealing of low-energy As-implanted Si have been investigated by comparing seco...
Since CMOS (Complementary metal-oxide-semiconductor) circuits were invented in 1963, CMOS technology...
Since CMOS (Complementary metal-oxide-semiconductor) circuits were invented in 1963, CMOS technology...
The transient enhanced diffusion of acceptor impurities severely affects the realization of ultrahig...
Fluorine is known to have a beneficial role for the B diffusion reduction in preamorphized Si, and i...
The transient enhanced diffusion of acceptor impurities severely affects the realization of ultrahig...
The transient enhanced diffusion (TED) of As in silicon samples implanted at 35 keV with dose 5*1015...
textThe 2005 International Technology Roadmap for Semiconductors predicts ultrashallow junctions (US...
textAs the size of modern transistors is continuously scaled down, challenges rise in almost every c...
textAs the size of modern transistors is continuously scaled down, challenges rise in almost every c...
The understanding of the behavior of arsenic in highly doped near surface silicon layers is of cruci...
The effects of an additional fluorine ion implantation i to highly doped n-type silicon were studied...
While it is known that F modifies dopant diffusion in crystalline Si, the physical mechanisms behind...
The transient enhanced diffusion of acceptor impurities severely affects the realization of ultrahig...
The transient enhanced diffusion of acceptor impurities severely affects the realization of ultrahig...
The behavior during annealing of low-energy As-implanted Si have been investigated by comparing seco...
Since CMOS (Complementary metal-oxide-semiconductor) circuits were invented in 1963, CMOS technology...
Since CMOS (Complementary metal-oxide-semiconductor) circuits were invented in 1963, CMOS technology...
The transient enhanced diffusion of acceptor impurities severely affects the realization of ultrahig...
Fluorine is known to have a beneficial role for the B diffusion reduction in preamorphized Si, and i...
The transient enhanced diffusion of acceptor impurities severely affects the realization of ultrahig...
The transient enhanced diffusion (TED) of As in silicon samples implanted at 35 keV with dose 5*1015...