Hybrid integration of two-dimensional (2D) materials on photonic integrated circuits (PICs) open a new avenue for integrated photonics because they offer additional functionality beyond those available with the native PIC platform, typically silicon nitride or silicon. For example, the unique properties of 2D materials like layer-tunable bandgap, high optical nonlinearity, direct band light emission, optical modulation, saturable absorption, can be harnessed for functions in PICs. This thesis focuses on the hybrid integration of 2D materials with PICs for optoelectronic applications. The development status of hybrid integrated 2D materials-based photodetectors and modulators is reviewed and gives a background introduction for our work that ...
Plasmonic nanoparticles with localized surface plasmon resonance (LSPR) are well-known for their uni...
The concept of virtual light microscope is to let users receive a digital emulation of histological ...
Ph.D.Modern electronic packaging for high-speed and high-frequency systems involves high-density con...
Ph.D.The recent wideband applications including Cloud Computing, Internet of Things (IoT), Augmented...
Ph.D.Driven by rapidly increasing data traffic in data centers, next generation optical interconnect...
Ph.D.Polydopamine (PDA), a bioinspired polymer derived from the self polymerization of monomeric dop...
Ph.D.In many E-commerce systems, they provide question answering (QA) platforms which can help users...
Assembly-based objects have been playing important roles in our life. While most assemblies are buil...
In this study, the white light emitting diodes (LEDs) were fabricated by combining the flip-chip dev...
Ph.D.Pixel level scene understanding is a fundamental while challenging task in computer vision. It ...
Ph.D.Untethered microrobots driven by external power sources have been drawing attention for decades...
Spontaneous intracerebral haemorrhage (ICH) is one of the most lethal forms of stroke and has a rela...
Since March 26, 2004, when the CBOE Futures Exchange (CFE) began trading futures written on S&P500 v...
高功率固体激光驱动器的前端系统作为一个高质量的种子光源,其作用是为后级提供一个具有一定整形能力、一定能量、一定脉冲宽度、一定频谱宽度和一定信噪比的高稳定高光束质量的种子激光脉冲。它主要包括主振荡器、脉...
AbstractAccording to the definition of specific surface, a convenient method was presented to estima...
Plasmonic nanoparticles with localized surface plasmon resonance (LSPR) are well-known for their uni...
The concept of virtual light microscope is to let users receive a digital emulation of histological ...
Ph.D.Modern electronic packaging for high-speed and high-frequency systems involves high-density con...
Ph.D.The recent wideband applications including Cloud Computing, Internet of Things (IoT), Augmented...
Ph.D.Driven by rapidly increasing data traffic in data centers, next generation optical interconnect...
Ph.D.Polydopamine (PDA), a bioinspired polymer derived from the self polymerization of monomeric dop...
Ph.D.In many E-commerce systems, they provide question answering (QA) platforms which can help users...
Assembly-based objects have been playing important roles in our life. While most assemblies are buil...
In this study, the white light emitting diodes (LEDs) were fabricated by combining the flip-chip dev...
Ph.D.Pixel level scene understanding is a fundamental while challenging task in computer vision. It ...
Ph.D.Untethered microrobots driven by external power sources have been drawing attention for decades...
Spontaneous intracerebral haemorrhage (ICH) is one of the most lethal forms of stroke and has a rela...
Since March 26, 2004, when the CBOE Futures Exchange (CFE) began trading futures written on S&P500 v...
高功率固体激光驱动器的前端系统作为一个高质量的种子光源,其作用是为后级提供一个具有一定整形能力、一定能量、一定脉冲宽度、一定频谱宽度和一定信噪比的高稳定高光束质量的种子激光脉冲。它主要包括主振荡器、脉...
AbstractAccording to the definition of specific surface, a convenient method was presented to estima...
Plasmonic nanoparticles with localized surface plasmon resonance (LSPR) are well-known for their uni...
The concept of virtual light microscope is to let users receive a digital emulation of histological ...
Ph.D.Modern electronic packaging for high-speed and high-frequency systems involves high-density con...