Real-time control of photoresist thickness uniformity during the bake process

In-situ critical dimension control during post-exposure bake with spectroscopic ellipsometry

Ngo, Y.S.
Qu, Y.
Tay, A.
Lee, T.H.

January 2012

10.1117/12.916133Proceedings of SPIE - The International Society for Optical Engineering8324-PSIS

A heater plate assisted integrated bake/chill system for photoresist processing

Chua, H.-T.
Tay, A.
Wang, Y.
Wu, X.

January 2007

10.1117/12.711688Proceedings of SPIE - The International Society for Optical Engineering6519PART 2-P...

Influence of resist baking on the pattern quality of thick photoresist

Löchel, B.
Rothe, M.
Grützner, G.
Fehlberg, S.
Beidießel, G.

January 1996

Besides bump fabrication and wire interconnect technology (WIT), the process of patterning thick lay...

Real-time control of photoresist thickness uniformity during the bake process

Lay, Lee Lay
Schaper, Charles
Khuen, Ho Weng

January 2000

10.1117/12.410103Proceedings of SPIE - The International Society for Optical Engineering418254-64PSI...

Control of Photoresist Thickness Uniformity in the Microlithography Process

Tay, A.

January 2003

10.1109/IECON.2003.1280565IECON Proceedings (Industrial Electronics Conference)32091-2096IEPR

Real-time control of photoresist development process

Tay, A.
Ho, W.-K.
Kiew, C.-M.
Zhou, Y.
Lee, J.H.

January 2005

10.1117/12.599630Proceedings of SPIE - The International Society for Optical Engineering5755244-250P...

Real-time control of photoresist absorption coefficient uniformity

Tay, A.
Ho, W.-K.
Wu, X.
Tsai, K.-Y.

January 2005

10.1117/12.598582Proceedings of SPIE - The International Society for Optical Engineering5755187-195P...

CD uniformity control via real-time control of photoresist properties

Chen, M.
Fu, J.
Ho, W.K.
Tay, A.

January 2008

10.1117/12.771418Proceedings of SPIE - The International Society for Optical Engineering6922-PSIS

In-situ real-time temperature control of baking systems in lithography

Wang, Y.
Chua, H.-T.
Tay, A.

January 2008

10.1117/12.772719Proceedings of SPIE - The International Society for Optical Engineering6922-PSIS

Critical dimension uniformity via real-time photoresist thickness control

Ho, W.K.
Tay, A.
Chen, M.
Fu, J.
Lu, H.
Shan, X.

November 2007

10.1109/TSM.2007.907610IEEE Transactions on Semiconductor Manufacturing204376-380ITSM

Integrated bake/chill system for across-wafer temperature uniformity control in photoresist processing

Chua, H.T.
Tay, A.
Wang, Y.

January 2009

10.1116/1.3117354Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structur...

Real-time control of photoresist extinction coefficient uniformity in the microlithography process

Tay, A.
Ho, W.K.
Wu, X.

January 2007

10.1109/TCST.2006.883244IEEE Transactions on Control Systems Technology15199-105IETT

Real-time spatial control of photoresist development rate

Tay, A.
Ho, W.-K.
Hu, N.
Kiew, C.-M.
Tsai, K.-Y.

January 2007

10.1117/12.711509Proceedings of SPIE - The International Society for Optical Engineering6518PART 2-P...

In-situ monitoring and control of photoresist parameters during thermal processing in the lithography sequence

Wu, X.
Yang, G.
Lim, E.-X.
Tay, A.

January 2009

10.1117/12.847879Proceedings of SPIE - The International Society for Optical Engineering7520-PSIS

Monitoring and control of photoresist properties and CD during photoresist processing

Yang, G.
Ngo, Y.-S.
Putra, A.S.
Ang, K.-T.
Tay, A.
Fang, Z.-P.

January 2010

10.1117/12.846560Proceedings of SPIE - The International Society for Optical Engineering7638-PSIS

In-situ critical dimension control during post-exposure bake with spectroscopic ellipsometry

Ngo, Y.S.
Qu, Y.
Tay, A.
Lee, T.H.

January 2012

10.1117/12.916133Proceedings of SPIE - The International Society for Optical Engineering8324-PSIS

A heater plate assisted integrated bake/chill system for photoresist processing

Chua, H.-T.
Tay, A.
Wang, Y.
Wu, X.

January 2007

10.1117/12.711688Proceedings of SPIE - The International Society for Optical Engineering6519PART 2-P...

Influence of resist baking on the pattern quality of thick photoresist

Löchel, B.
Rothe, M.
Grützner, G.
Fehlberg, S.
Beidießel, G.

January 1996

Besides bump fabrication and wire interconnect technology (WIT), the process of patterning thick lay...

Real-time control of photoresist thickness uniformity during the bake process

Lay, Lee Lay
Schaper, Charles
Khuen, Ho Weng

January 2000

10.1117/12.410103Proceedings of SPIE - The International Society for Optical Engineering418254-64PSI...

Control of Photoresist Thickness Uniformity in the Microlithography Process

Tay, A.

January 2003

10.1109/IECON.2003.1280565IECON Proceedings (Industrial Electronics Conference)32091-2096IEPR

Real-time control of photoresist development process

Tay, A.
Ho, W.-K.
Kiew, C.-M.
Zhou, Y.
Lee, J.H.

January 2005

10.1117/12.599630Proceedings of SPIE - The International Society for Optical Engineering5755244-250P...

Real-time control of photoresist absorption coefficient uniformity

Tay, A.
Ho, W.-K.
Wu, X.
Tsai, K.-Y.

January 2005

10.1117/12.598582Proceedings of SPIE - The International Society for Optical Engineering5755187-195P...

CD uniformity control via real-time control of photoresist properties

Chen, M.
Fu, J.
Ho, W.K.
Tay, A.

January 2008

10.1117/12.771418Proceedings of SPIE - The International Society for Optical Engineering6922-PSIS

In-situ real-time temperature control of baking systems in lithography

Wang, Y.
Chua, H.-T.
Tay, A.

January 2008

10.1117/12.772719Proceedings of SPIE - The International Society for Optical Engineering6922-PSIS

Critical dimension uniformity via real-time photoresist thickness control

Ho, W.K.
Tay, A.
Chen, M.
Fu, J.
Lu, H.
Shan, X.

November 2007

10.1109/TSM.2007.907610IEEE Transactions on Semiconductor Manufacturing204376-380ITSM

Integrated bake/chill system for across-wafer temperature uniformity control in photoresist processing

Chua, H.T.
Tay, A.
Wang, Y.

January 2009

10.1116/1.3117354Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structur...

Real-time control of photoresist extinction coefficient uniformity in the microlithography process

Tay, A.
Ho, W.K.
Wu, X.

January 2007

10.1109/TCST.2006.883244IEEE Transactions on Control Systems Technology15199-105IETT

Real-time spatial control of photoresist development rate

Tay, A.
Ho, W.-K.
Hu, N.
Kiew, C.-M.
Tsai, K.-Y.

January 2007

10.1117/12.711509Proceedings of SPIE - The International Society for Optical Engineering6518PART 2-P...

In-situ monitoring and control of photoresist parameters during thermal processing in the lithography sequence

Wu, X.
Yang, G.
Lim, E.-X.
Tay, A.

January 2009

10.1117/12.847879Proceedings of SPIE - The International Society for Optical Engineering7520-PSIS

Monitoring and control of photoresist properties and CD during photoresist processing

Yang, G.
Ngo, Y.-S.
Putra, A.S.
Ang, K.-T.
Tay, A.
Fang, Z.-P.

January 2010

10.1117/12.846560Proceedings of SPIE - The International Society for Optical Engineering7638-PSIS

In-situ critical dimension control during post-exposure bake with spectroscopic ellipsometry

Ngo, Y.S.
Qu, Y.
Tay, A.
Lee, T.H.

January 2012

10.1117/12.916133Proceedings of SPIE - The International Society for Optical Engineering8324-PSIS

A heater plate assisted integrated bake/chill system for photoresist processing

Chua, H.-T.
Tay, A.
Wang, Y.
Wu, X.

January 2007

10.1117/12.711688Proceedings of SPIE - The International Society for Optical Engineering6519PART 2-P...

Influence of resist baking on the pattern quality of thick photoresist

Löchel, B.
Rothe, M.
Grützner, G.
Fehlberg, S.
Beidießel, G.

January 1996

Besides bump fabrication and wire interconnect technology (WIT), the process of patterning thick lay...

Real-time control of photoresist thickness uniformity during the bake process

Abstract

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Real-time control of photoresist thickness uniformity during the bake process

Abstract

Extracted data

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