10.1109/TEPM.2005.856539IEEE Transactions on Electronics Packaging Manufacturing284322-327ITEP
A mechanical component may fail in many modes that are usually not independent. There is generally n...
[[abstract]]For the purpose of enhancing the solder joint reliability of a wafer level chip scaling ...
With the continuous increase of packaging density, the electronic component size and, in particular,...
2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics19...
In this paper a generic four-parameter model has been developed and applied to the ACA flip-chip joi...
In this paper a generic four-parameter model has been developed and applied to the ACA flip-chip joi...
Reliability estimation procedures are discussed for the example of fatigue development in solder joi...
In this paper, we study three different models, each involving two Weibull distributions, to model f...
The Weibull model is widely used for estimating the reliability of engineering materials. More relia...
The main objective in this study was to identify the impact of material properties on reliability, s...
Linear Elastic Fracture Mechanics (LEFM), Cohesive Zone Models (CZMs) and damage mechanics all addre...
An attempt is made to evaluate all possible stress based failure criteria that have been otherwise t...
The aim of this research is to understand the failure modes and mechanisms of adhesive materials use...
This paper discusses the estimation of the failure probability during the warranty period. The failu...
Joining by adhesively bonded methods is being increasingly used in the design of mechanical structur...
A mechanical component may fail in many modes that are usually not independent. There is generally n...
[[abstract]]For the purpose of enhancing the solder joint reliability of a wafer level chip scaling ...
With the continuous increase of packaging density, the electronic component size and, in particular,...
2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics19...
In this paper a generic four-parameter model has been developed and applied to the ACA flip-chip joi...
In this paper a generic four-parameter model has been developed and applied to the ACA flip-chip joi...
Reliability estimation procedures are discussed for the example of fatigue development in solder joi...
In this paper, we study three different models, each involving two Weibull distributions, to model f...
The Weibull model is widely used for estimating the reliability of engineering materials. More relia...
The main objective in this study was to identify the impact of material properties on reliability, s...
Linear Elastic Fracture Mechanics (LEFM), Cohesive Zone Models (CZMs) and damage mechanics all addre...
An attempt is made to evaluate all possible stress based failure criteria that have been otherwise t...
The aim of this research is to understand the failure modes and mechanisms of adhesive materials use...
This paper discusses the estimation of the failure probability during the warranty period. The failu...
Joining by adhesively bonded methods is being increasingly used in the design of mechanical structur...
A mechanical component may fail in many modes that are usually not independent. There is generally n...
[[abstract]]For the purpose of enhancing the solder joint reliability of a wafer level chip scaling ...
With the continuous increase of packaging density, the electronic component size and, in particular,...
DOI
Add to ORKG