Enhanced control of thermal transport through metal-polymer interfaces is in demand as metal-polymer composites and organic electronics proliferate while continuous component miniaturization is pursued. Thermal conductivity of polymers is low, therefore thermal boundary conductance (TBC), describing the added resistance of interfaces, only becomes important when polymer component dimensions reach the nanometer scale. TBC is an elusive quantity to measure, requiring advanced experimental setups coupled to system-wide simulations of precisely defined model systems with the mentioned dimensions. Such model systems, for use in three different thermal characterization methods were developed and accurately characterized in this thesis work. The...
Thermal diffusion measurements on polymethylmethacrylate-coated Si substrates using heated atomic fo...
Heat conduction through bonded metal–polymer interfaces often limits the overall heat transfer in el...
With the continual increase in cooling demand for microprocessors, the microelectronics industry has...
In organic electronics, thermal management is a challenge, as most organic materials conduct heat po...
In organic electronics, thermal management is a challenge, as most organic materials conduct heat po...
<p>Polymers are attractive candidates for the packaging industry given their ease of processing, abu...
Polymers are attractive candidates for the packaging industry given their ease of processing, abunda...
abstract: This thesis project explains what thermal interface materials (TIMs) are, what they are us...
Heat dissipation has become a `bottleneck' for the properties of electronics products and photoelect...
Heat dissipation has become a `bottleneck\u27 for the properties of electronics products and photoel...
The need for faster, smaller, and more reliable and efficient products has resulted in increase of h...
The need for faster, smaller, and more reliable and efficient products has resulted in increase of h...
Thermal diffusion measurements on polymethylmethacrylate-coated Si substrates using heated atomic fo...
The increasing trend of further scaling down electronic components put an increasing demand for more...
The increasing trend of further scaling down electronic components put an increasing demand for more...
Thermal diffusion measurements on polymethylmethacrylate-coated Si substrates using heated atomic fo...
Heat conduction through bonded metal–polymer interfaces often limits the overall heat transfer in el...
With the continual increase in cooling demand for microprocessors, the microelectronics industry has...
In organic electronics, thermal management is a challenge, as most organic materials conduct heat po...
In organic electronics, thermal management is a challenge, as most organic materials conduct heat po...
<p>Polymers are attractive candidates for the packaging industry given their ease of processing, abu...
Polymers are attractive candidates for the packaging industry given their ease of processing, abunda...
abstract: This thesis project explains what thermal interface materials (TIMs) are, what they are us...
Heat dissipation has become a `bottleneck' for the properties of electronics products and photoelect...
Heat dissipation has become a `bottleneck\u27 for the properties of electronics products and photoel...
The need for faster, smaller, and more reliable and efficient products has resulted in increase of h...
The need for faster, smaller, and more reliable and efficient products has resulted in increase of h...
Thermal diffusion measurements on polymethylmethacrylate-coated Si substrates using heated atomic fo...
The increasing trend of further scaling down electronic components put an increasing demand for more...
The increasing trend of further scaling down electronic components put an increasing demand for more...
Thermal diffusion measurements on polymethylmethacrylate-coated Si substrates using heated atomic fo...
Heat conduction through bonded metal–polymer interfaces often limits the overall heat transfer in el...
With the continual increase in cooling demand for microprocessors, the microelectronics industry has...