Polymers are attractive candidates for the packaging industry given their ease of processing, abundance, and versatility. The poor thermal transport properties of these materials, however, limit their application in the packaging of high energy density materials. To circumvent this shortcoming, much work has gone into embedding thermally conductive additives into polymer matrices to enhance the overall thermal conductivity (k)). Predicting composite thermal conductivity (k) has shown to be difficult given the thermal boundary resistance (TBR) present at the particle matrix interface and the limited understanding of parameters effecting TBR. While previous work has explored effects of bond strength at inorganic−organic interfaces, nothing ha...
Polymer nanocomposites with high thermal conductivity have been increasingly sought after in the ele...
Polymer nanocomposites with high thermal conductivity have been increasingly sought after in the ele...
The lifespan and the performance of flexible electronic devices and components are affected by the l...
<p>Polymers are attractive candidates for the packaging industry given their ease of processing, abu...
In this paper the thermal conductivity of epoxy-based composite materials is analysed. Two- and thre...
In this paper the thermal conductivity of epoxy-based composite materials is analysed. Two and three...
In this paper the thermal conductivity of epoxy-based composite materials is analysed. Two and three...
The growing demand toward miniaturization and power device packaging required new die-attach materia...
The enthalpic incompatibility of organic polymer matrices and high surface energy inorganic nanopart...
Thermal management in polymeric composite materials has become increasingly critical in the air-vehi...
The enhancement of structural and thermo-mechanical properties of polymer nanocomposites(PNCs) that ...
In recent years, with the discovery of low-dimensional materials and the advance of fabrications, na...
The lifespan and the performance of flexible electronic devices and components are affected by the l...
Heterogeneous nanofillers have been regarded as a promising candidate for enhancing the thermal cond...
The process of heat transfer in polymer systems and composites due to the variety of factors determi...
Polymer nanocomposites with high thermal conductivity have been increasingly sought after in the ele...
Polymer nanocomposites with high thermal conductivity have been increasingly sought after in the ele...
The lifespan and the performance of flexible electronic devices and components are affected by the l...
<p>Polymers are attractive candidates for the packaging industry given their ease of processing, abu...
In this paper the thermal conductivity of epoxy-based composite materials is analysed. Two- and thre...
In this paper the thermal conductivity of epoxy-based composite materials is analysed. Two and three...
In this paper the thermal conductivity of epoxy-based composite materials is analysed. Two and three...
The growing demand toward miniaturization and power device packaging required new die-attach materia...
The enthalpic incompatibility of organic polymer matrices and high surface energy inorganic nanopart...
Thermal management in polymeric composite materials has become increasingly critical in the air-vehi...
The enhancement of structural and thermo-mechanical properties of polymer nanocomposites(PNCs) that ...
In recent years, with the discovery of low-dimensional materials and the advance of fabrications, na...
The lifespan and the performance of flexible electronic devices and components are affected by the l...
Heterogeneous nanofillers have been regarded as a promising candidate for enhancing the thermal cond...
The process of heat transfer in polymer systems and composites due to the variety of factors determi...
Polymer nanocomposites with high thermal conductivity have been increasingly sought after in the ele...
Polymer nanocomposites with high thermal conductivity have been increasingly sought after in the ele...
The lifespan and the performance of flexible electronic devices and components are affected by the l...