Growth mechanism of copper column by electrodeposition for electronic interconnections
- Liu, Jun
- Liu, Changqing
- Conway, Paul P.
Publication date
November 2008
DOI Publisher
Institute of Electrical and Electronics Engineers (IEEE)Abstract
Formation mechanism of copper columns by electrodeposition has been discussed by observing the evolution of surface morphology and microstructure of these columns electrodeposited from 16ms to 3 hours. Based on this study, a heuristic model is proposed to describe the growth mechanism of copper column which provides guidance for controlling microstructure of electrodeposited copper columns for fine pitch electronic interconnections. {\textcopyright}2008 IEEE
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