Abstract: Electrodeposition of copper from acid sulfate solutions at overpotentials on the plateau of the limiting diffusion current density and at higher overpotentials was examined. The average current efficiencies for hydrogen evolution reaction are determined by a measurement of the quantity of evolved hydrogen and the overall electrodeposition current as a function of electrodeposition time, while morphologies of copper deposits are examined by the use of the scanning electron microscopy (SEM) technique. It is found that the open and porous structures of copper deposits (denoted and as honeycomb – like copper structures), suitable for electrodes in electrochemical devices such as fuel cells and chemical sensors, were reached by electro...
Electrodeposition of copper by pulsating overpotential (PO) regime in the hydrogen co-deposition ran...
Copper electrodeposition from acid sulfate solutions at an overpotential of 1000 mV, which is about ...
The effect of temperature on the electrodeposition of copper at overpotentials belonging to the plat...
Electrodeposition of copper from acid sulfate solutions at overpotentials on theplateau of the limit...
Electrodeposition of copper from acid sulfate solutions at overpotentials on the plateau of the limi...
Electrodeposition of copper from acid sulfate solutions at overpotentials on the plateau of the limi...
Electrodeposition of copper by pulsating overpotential (PO) regime in the hydrogen co-deposition ran...
Electrodeposition of copper by pulsating overpotential (PO) regime in the hydrogen co-deposition ran...
Formation of irregular deposits by electrodeposition from acid sulfate solutions of various H2SO4 co...
This a review paper considering fundamental aspects of copper electrodeposition at high overpotentia...
Formation of irregular deposits by electrodeposition from acid sulfate solutions of various H2SO4 co...
The electrodeposition of copper onto copper, gold, palladium and glassy carbon (GC) electrodes via a...
The electrodeposition of copper onto copper, gold, palladium and glassy carbon (GC) electrodes via a...
The effects of codeposition of hydrogen on the structure of electrodeposited copper is discussed. T...
Electrodeposition of copper by pulsating overpotential (PO) regime in the hydrogen co-deposition ran...
Electrodeposition of copper by pulsating overpotential (PO) regime in the hydrogen co-deposition ran...
Copper electrodeposition from acid sulfate solutions at an overpotential of 1000 mV, which is about ...
The effect of temperature on the electrodeposition of copper at overpotentials belonging to the plat...
Electrodeposition of copper from acid sulfate solutions at overpotentials on theplateau of the limit...
Electrodeposition of copper from acid sulfate solutions at overpotentials on the plateau of the limi...
Electrodeposition of copper from acid sulfate solutions at overpotentials on the plateau of the limi...
Electrodeposition of copper by pulsating overpotential (PO) regime in the hydrogen co-deposition ran...
Electrodeposition of copper by pulsating overpotential (PO) regime in the hydrogen co-deposition ran...
Formation of irregular deposits by electrodeposition from acid sulfate solutions of various H2SO4 co...
This a review paper considering fundamental aspects of copper electrodeposition at high overpotentia...
Formation of irregular deposits by electrodeposition from acid sulfate solutions of various H2SO4 co...
The electrodeposition of copper onto copper, gold, palladium and glassy carbon (GC) electrodes via a...
The electrodeposition of copper onto copper, gold, palladium and glassy carbon (GC) electrodes via a...
The effects of codeposition of hydrogen on the structure of electrodeposited copper is discussed. T...
Electrodeposition of copper by pulsating overpotential (PO) regime in the hydrogen co-deposition ran...
Electrodeposition of copper by pulsating overpotential (PO) regime in the hydrogen co-deposition ran...
Copper electrodeposition from acid sulfate solutions at an overpotential of 1000 mV, which is about ...
The effect of temperature on the electrodeposition of copper at overpotentials belonging to the plat...