Wire-bonding Overview and Packaging Toolsets at Georgia Tech IEN

Presented on June 11, 2020 from 11:00 a.m.-12:00 p.m. SENIC Technical Webinar Series: Session 8.The Southeastern Nanotechnology Infrastructure Corridor (SENIC) housed at the Institute for Electronics and Nanotechnology at Georgia Tech hosted a series of online technical seminars, open to the academic and industrial community with an interest in cleanroom fabrication and processing for materials, biological, and electronics research.Mr. Chris White is currently the packaging tool support lead within the Institute for Electronics and Nanotechnology at the Georgia Institute of Technology. He received his bachelor’s degree in Electrical Engineering from Georgia Tech in 2009 and started working in the Packaging Research Center on campus to support the research labs within the center. His team currently supports the packaging toolsets within the IEN shared user labs with a primary focus on microelectronics assembly process tools.Runtime: 61:29 minutesThe shared user labs within the Institute for Electronics and Nanotechnology at Georgia Tech include an electronics packaging toolset. A brief overview of assembly and interconnection toolsets and technologies available within IEN will be presented. A process overview on wire-bonding capabilities will also be discussed