Add to ORKGIn this project, plating in electrolytes with and without additives was evaluated. The impact of these electrolytes and various plating parameters such as current density, current pulse waveforms, wafer rotation on the characteristics of the plated Cu film were studied.Master of Engineering (SME
Electroforming is a metal forming process that forms parts through electrodeposition. The overall s...
Electrochemical behaviors of the base electrolyte containing different additives were investigated b...
In the recent years, copper has been replacing aluminum to be widely used as the interconnect materi...
In this project, plating in electrolytes with and without additives was evaluated. The impact of the...
Obtain a fundamental understanding of the interactions between the organic additives and their effec...
An in-depth study of the copper electroplating process was carried out with different process parame...
There is great interest in the semiconductor industry to move to copper for advanced interconnect pr...
The copper electroplating process for dual damascene metallization of semiconductor interconnects i...
[[abstract]]This work examines the impact of the wetting ability of a plating electrolyte on the Cu ...
[[abstract]]This work examines the impact of the wetting ability of a plating electrolyte on the Cu ...
[[abstract]]This work examines the impact of the wetting ability of a plating electrolyte on the Cu ...
We have utilized electroplating technology in a damascene process to produce low resistance copper i...
In the electrochemical deposition of copper on structured substrates, additives are commonly used as...
The aim of this investigation is to test the factors that affect electroplating. To narrow down the ...
Electroforming is a metal forming process that forms parts through electrodeposition. The overall s...
Electroforming is a metal forming process that forms parts through electrodeposition. The overall s...
Electrochemical behaviors of the base electrolyte containing different additives were investigated b...
In the recent years, copper has been replacing aluminum to be widely used as the interconnect materi...
In this project, plating in electrolytes with and without additives was evaluated. The impact of the...
Obtain a fundamental understanding of the interactions between the organic additives and their effec...
An in-depth study of the copper electroplating process was carried out with different process parame...
There is great interest in the semiconductor industry to move to copper for advanced interconnect pr...
The copper electroplating process for dual damascene metallization of semiconductor interconnects i...
[[abstract]]This work examines the impact of the wetting ability of a plating electrolyte on the Cu ...
[[abstract]]This work examines the impact of the wetting ability of a plating electrolyte on the Cu ...
[[abstract]]This work examines the impact of the wetting ability of a plating electrolyte on the Cu ...
We have utilized electroplating technology in a damascene process to produce low resistance copper i...
In the electrochemical deposition of copper on structured substrates, additives are commonly used as...
The aim of this investigation is to test the factors that affect electroplating. To narrow down the ...
Electroforming is a metal forming process that forms parts through electrodeposition. The overall s...
Electroforming is a metal forming process that forms parts through electrodeposition. The overall s...
Electrochemical behaviors of the base electrolyte containing different additives were investigated b...
In the recent years, copper has been replacing aluminum to be widely used as the interconnect materi...