Add to ORKGObtain a fundamental understanding of the interactions between the organic additives and their effects on mechanism of the plating process. Study the effects of current density (both DC and pulsed waveform) on the properties of Cu films electroplated from baths with different additives. Study the effects of substrate on the properties of the electroplated Cu films.Master of Engineerin
10.1016/S0921-5107(00)00544-4Materials Science and Engineering B: Solid-State Materials for Advanced...
Electrochemical behaviors of the base electrolyte containing different additives were investigated b...
The behaviors of various electroplated copper films during CMP are important for removal mechanism a...
In this project, plating in electrolytes with and without additives was evaluated. The impact of the...
In this project, plating in electrolytes with and without additives was evaluated. The impact of the...
[[abstract]]This work examines the impact of the wetting ability of a plating electrolyte on the Cu ...
[[abstract]]This work examines the impact of the wetting ability of a plating electrolyte on the Cu ...
[[abstract]]This work examines the impact of the wetting ability of a plating electrolyte on the Cu ...
In the electrochemical deposition of copper on structured substrates, additives are commonly used as...
There is great interest in the semiconductor industry to move to copper for advanced interconnect pr...
In the recent years, copper has been replacing aluminum to be widely used as the interconnect materi...
An in-depth study of the copper electroplating process was carried out with different process parame...
Surface morphology, crystallographic texture and microstructure of Cu films deposited at temperature...
The kinetics of the Cu/Cu2+ have been defined clearly from experiments on a copper microdisc el...
This study uses secondary-ion-mass spectrometry to examine the effects of plating current density an...
10.1016/S0921-5107(00)00544-4Materials Science and Engineering B: Solid-State Materials for Advanced...
Electrochemical behaviors of the base electrolyte containing different additives were investigated b...
The behaviors of various electroplated copper films during CMP are important for removal mechanism a...
In this project, plating in electrolytes with and without additives was evaluated. The impact of the...
In this project, plating in electrolytes with and without additives was evaluated. The impact of the...
[[abstract]]This work examines the impact of the wetting ability of a plating electrolyte on the Cu ...
[[abstract]]This work examines the impact of the wetting ability of a plating electrolyte on the Cu ...
[[abstract]]This work examines the impact of the wetting ability of a plating electrolyte on the Cu ...
In the electrochemical deposition of copper on structured substrates, additives are commonly used as...
There is great interest in the semiconductor industry to move to copper for advanced interconnect pr...
In the recent years, copper has been replacing aluminum to be widely used as the interconnect materi...
An in-depth study of the copper electroplating process was carried out with different process parame...
Surface morphology, crystallographic texture and microstructure of Cu films deposited at temperature...
The kinetics of the Cu/Cu2+ have been defined clearly from experiments on a copper microdisc el...
This study uses secondary-ion-mass spectrometry to examine the effects of plating current density an...
10.1016/S0921-5107(00)00544-4Materials Science and Engineering B: Solid-State Materials for Advanced...
Electrochemical behaviors of the base electrolyte containing different additives were investigated b...
The behaviors of various electroplated copper films during CMP are important for removal mechanism a...