The electrochemical behavior of tin was studied with cyclic voltammetry at glassy carbon electrodes in the fused LiCl-KCl at 450 ℃. Metallic tin deposition on the glassy carbon electrode occurs at a potential of around -0.56 V with Ag/AgCl reference electrode. the diffusion coefficient DSn 2+ is determined to be 3.0×10-5 cm2 s -1 . At higher anodic voltage, Sn2+ is oxidised to Sn4+. The average number of electrons was determined to be 2 by using the difference between the peak and half peak potentials. Metallic tin was prepared in potentiostatic mode at -0.7 V versus Ag+ /Ag reference for 4 hours. Mass transport towards the electrode is a simple diffusion process and the diffusion coefficient was calculated. The current efficiency for depos...
Thesis: S.B., Massachusetts Institute of Technology, Department of Materials Science and Engineering...
Tin is a common element generally added to many materials to improve the corrosion resistance. This ...
The anodic dissolution and partial passivation of tin in 4.5–8 M sulphuric acid solutions has been s...
The electrochemical behavior of tin was studied with cyclic voltammetry at glassy carbon electrodes ...
Recycling of electronic waste to recover the metal value is of prime importance, especially for meta...
The electrochemistry of Sn(II) was investigated with cyclic voltammetry and chronoamperometry in the...
The electrodeposition of tin, at a copper surface, from a tin sulphate (0˙014 mol dm–3) electrolyte ...
The electrodeposition of tin was investigated in the room temperature molten salt based on 1-methyl-...
A new room temperature molten salt (RTMS) [1-methyl-3-ethylimidazolium/AlCl3/SnCl2 (3:2:0.5)] was de...
The electrochemical behavior of plasma-formed tin films on aluminum is compared with that of convent...
Voltammetry and chronoamperometry for the electrodeposition of tin from Tin(II) methane sulfonate mi...
The corrosion behaviour of titanium nitride (TiN) CVD coatings on AISI 316L stainless steel and on i...
The electrodeposition of tin from Tin(II) Methane Sulfonate (MSA) with varying concentration in air...
International audienceThe electrochemical behavior of Sn(II) was studied at 25°C in three different ...
The electrochemistry of dilute tin amalgam in perchlorate solution was investigated intensively usin...
Thesis: S.B., Massachusetts Institute of Technology, Department of Materials Science and Engineering...
Tin is a common element generally added to many materials to improve the corrosion resistance. This ...
The anodic dissolution and partial passivation of tin in 4.5–8 M sulphuric acid solutions has been s...
The electrochemical behavior of tin was studied with cyclic voltammetry at glassy carbon electrodes ...
Recycling of electronic waste to recover the metal value is of prime importance, especially for meta...
The electrochemistry of Sn(II) was investigated with cyclic voltammetry and chronoamperometry in the...
The electrodeposition of tin, at a copper surface, from a tin sulphate (0˙014 mol dm–3) electrolyte ...
The electrodeposition of tin was investigated in the room temperature molten salt based on 1-methyl-...
A new room temperature molten salt (RTMS) [1-methyl-3-ethylimidazolium/AlCl3/SnCl2 (3:2:0.5)] was de...
The electrochemical behavior of plasma-formed tin films on aluminum is compared with that of convent...
Voltammetry and chronoamperometry for the electrodeposition of tin from Tin(II) methane sulfonate mi...
The corrosion behaviour of titanium nitride (TiN) CVD coatings on AISI 316L stainless steel and on i...
The electrodeposition of tin from Tin(II) Methane Sulfonate (MSA) with varying concentration in air...
International audienceThe electrochemical behavior of Sn(II) was studied at 25°C in three different ...
The electrochemistry of dilute tin amalgam in perchlorate solution was investigated intensively usin...
Thesis: S.B., Massachusetts Institute of Technology, Department of Materials Science and Engineering...
Tin is a common element generally added to many materials to improve the corrosion resistance. This ...
The anodic dissolution and partial passivation of tin in 4.5–8 M sulphuric acid solutions has been s...