The electrodeposition of tin was investigated in the room temperature molten salt based on 1-methyl-3-ethylimidizalium/AlCl3/SnCl 2. The results show that the morphology and size of the tin crystallites are strongly influenced by the composition of the melts and the deposition potentials, producing tin deposits with different shapes and widely various size ranges from several micrometers to nanometers. Double potentiostatic pulse deposition technique has been used to control the morphology and particle size of tin deposits. Nano-size tin particles around 50nm with more regular shape and uniform size distribution can be obtained successfully by a balanced control of the nucleation and growth of the tin deposits. copyright The Electrochemical...
The tin electroplating process was studied by means of electrochemical impedance and noise (EN) tech...
International audienceThe electrochemical behavior of Sn(II) was studied at 25°C in three different ...
Films of nanometric Cu-Sn intermetallic compounds have been prepared by electrodeposition under spon...
The electrochemistry of Sn(II) was investigated with cyclic voltammetry and chronoamperometry in the...
A new room temperature molten salt (RTMS) [1-methyl-3-ethylimidazolium/AlCl3/SnCl2 (3:2:0.5)] was de...
The importance of tin and its electrodeposition are summarised and the scope for plating tin is outl...
The mechanism of nucleation and growth of tin electrodeposits was investigated. Also the influences...
The electrochemical behavior of tin was studied with cyclic voltammetry at glassy carbon electrodes ...
The electrodeposition of tin from Tin(II) Methane Sulfonate (MSA) with varying concentration in air...
The deposition of Sn–Cu binary alloys, mainly from aqueous electrolytes, is considered. The importan...
Tin electrodeposition applications have rapidly evolved in the past 25 years. Usage of tin coatings ...
Recycling of electronic waste to recover the metal value is of prime importance, especially for meta...
The experimental results obtained on electroless and electrodeposition of tin on gold surfaces sputt...
Electrodeposition of Sn from supercritical difluoromethane has been performed into anodic alumina te...
The electrodeposition of tin from SnO in ionic liquid 1-butyl-3-methylimidazolium hydrogen sulfate (...
The tin electroplating process was studied by means of electrochemical impedance and noise (EN) tech...
International audienceThe electrochemical behavior of Sn(II) was studied at 25°C in three different ...
Films of nanometric Cu-Sn intermetallic compounds have been prepared by electrodeposition under spon...
The electrochemistry of Sn(II) was investigated with cyclic voltammetry and chronoamperometry in the...
A new room temperature molten salt (RTMS) [1-methyl-3-ethylimidazolium/AlCl3/SnCl2 (3:2:0.5)] was de...
The importance of tin and its electrodeposition are summarised and the scope for plating tin is outl...
The mechanism of nucleation and growth of tin electrodeposits was investigated. Also the influences...
The electrochemical behavior of tin was studied with cyclic voltammetry at glassy carbon electrodes ...
The electrodeposition of tin from Tin(II) Methane Sulfonate (MSA) with varying concentration in air...
The deposition of Sn–Cu binary alloys, mainly from aqueous electrolytes, is considered. The importan...
Tin electrodeposition applications have rapidly evolved in the past 25 years. Usage of tin coatings ...
Recycling of electronic waste to recover the metal value is of prime importance, especially for meta...
The experimental results obtained on electroless and electrodeposition of tin on gold surfaces sputt...
Electrodeposition of Sn from supercritical difluoromethane has been performed into anodic alumina te...
The electrodeposition of tin from SnO in ionic liquid 1-butyl-3-methylimidazolium hydrogen sulfate (...
The tin electroplating process was studied by means of electrochemical impedance and noise (EN) tech...
International audienceThe electrochemical behavior of Sn(II) was studied at 25°C in three different ...
Films of nanometric Cu-Sn intermetallic compounds have been prepared by electrodeposition under spon...