International audienceThe water transfer printing method is used to transfer patterned films on random three-dimensional objects. This industrially viable technology has been demonstrated to intimately wrap metallic and polymeric films around different materials. This method avoids the use of rigid substrate during the transfer step. Patterns can be transferred to objects without folds even when holed, addressing a challenging issue in the field of conformal electronics. This technique enables to reach high films bending properties. This promising method, enables to integrate large-area films onto daily-life objects. Bent capacitive touchpad is fabricated showing the potential applications of this technology
The integration of electronics into the process flow of the additive manufacturing of 3D objects is ...
Perfectly wrapping planar electronics to complex 3D surfaces represents a major challenge in the man...
Perfectly wrapping planar electronics to complex 3D surfaces represents a major challenge in the man...
International audienceThe water transfer printing method is used to transfer patterned films on rand...
International audienceThe water transfer printing method is used to transfer patterned films on rand...
International audienceThe water transfer printing method is used to transfer patterned films on rand...
International audienceThe water transfer printing method is used to transfer patterned films on rand...
The water transfer printing method is used to transfer patterned films on random three-dimensional o...
The water transfer printing method is used to transfer patterned films on random three-dimensional o...
The water transfer printing method is used to transfer patterned films on random three-dimensional o...
International audienceThe integration of electronics into the process flow of the additive manufactu...
International audienceThe integration of electronics into the process flow of the additive manufactu...
International audienceThe integration of electronics into the process flow of the additive manufactu...
International audienceThe integration of electronics into the process flow of the additive manufactu...
The integration of electronics into the process flow of the additive manufacturing of 3D objects is ...
The integration of electronics into the process flow of the additive manufacturing of 3D objects is ...
Perfectly wrapping planar electronics to complex 3D surfaces represents a major challenge in the man...
Perfectly wrapping planar electronics to complex 3D surfaces represents a major challenge in the man...
International audienceThe water transfer printing method is used to transfer patterned films on rand...
International audienceThe water transfer printing method is used to transfer patterned films on rand...
International audienceThe water transfer printing method is used to transfer patterned films on rand...
International audienceThe water transfer printing method is used to transfer patterned films on rand...
The water transfer printing method is used to transfer patterned films on random three-dimensional o...
The water transfer printing method is used to transfer patterned films on random three-dimensional o...
The water transfer printing method is used to transfer patterned films on random three-dimensional o...
International audienceThe integration of electronics into the process flow of the additive manufactu...
International audienceThe integration of electronics into the process flow of the additive manufactu...
International audienceThe integration of electronics into the process flow of the additive manufactu...
International audienceThe integration of electronics into the process flow of the additive manufactu...
The integration of electronics into the process flow of the additive manufacturing of 3D objects is ...
The integration of electronics into the process flow of the additive manufacturing of 3D objects is ...
Perfectly wrapping planar electronics to complex 3D surfaces represents a major challenge in the man...
Perfectly wrapping planar electronics to complex 3D surfaces represents a major challenge in the man...