The oxidation of artificial cuprous sulphide electrodes (Cu/S ratio = 1.93) was studied in acidified copper sulphate solutions in the temperature range 20 to 35° C. Rest potential measurements gave V° = 0.490 volts for the electrode or half cell potential. This is within the limits of accuracy of V° for: Cu₂S —CuS + Cu⁺⁺ + 2e V° = 0.535 + 0.13 volts The discrepancy was thought to be related to the large Cu deficien in the sulphide. In solutions with pH>4, the rest potential measurements were consistent with the following reaction: Cu₂S + 2H₂0 —CuS + Cu(OH)₂ + 2H⁺ + 2e Polarization measurements at low overpotential gave values for the following kinetic parameters: β, the symmetry factor = 1/2 λ, the number of electrons involved in eac...
The oxidation of covellite, CuS, to copper(II) and sulfur or sulfate ions in aqueous ammonia is slow...
The oxidation kinetics of molten copper sulphide were investigated by quantitative measurements and ...
The effect of chloride ion on the deposition of copper from low metal concentrations in aqueous, aci...
The oxidation of artificial cuprous sulphide electrodes (Cu/S ratio = 1.93) was studied in acidified...
The Cu-S binary system was subjected to electrochemical studies at temperatures below 100°C in acid ...
The anodic behaviour of copper in aqueous 0.5 M sulphuric acid containing different amounts of disso...
The electrochemical behaviour of copper anodes in aqueous thiourea (TU)-containing sulphuric acid wa...
The electrochemical behaviour of copper anodes in aqueous thiourea (TU)-containing sulphuric acid wa...
The anodic oxidation of sulphur dioxide dissolved either in distilled water or in acid solutions of ...
Electrowinning (EW) is becoming an increasingly important method of recovering copper from aqueous a...
The anodisation of copper electrodes in aqueous thiourea (TU) containing 0.5 M sulphuric acid is stu...
The growing interest in the electrowinning of copper has lead to several modifications including ano...
Cupric ions are a major component in electrolyte baths for Damascene copper plating. To unravel the ...
As it is known, electrolytic processes use up electrical energy to bring about redox reactions. In t...
A combination of thermodynamic analyses and potentiodynamic polarization tests have been used to stu...
The oxidation of covellite, CuS, to copper(II) and sulfur or sulfate ions in aqueous ammonia is slow...
The oxidation kinetics of molten copper sulphide were investigated by quantitative measurements and ...
The effect of chloride ion on the deposition of copper from low metal concentrations in aqueous, aci...
The oxidation of artificial cuprous sulphide electrodes (Cu/S ratio = 1.93) was studied in acidified...
The Cu-S binary system was subjected to electrochemical studies at temperatures below 100°C in acid ...
The anodic behaviour of copper in aqueous 0.5 M sulphuric acid containing different amounts of disso...
The electrochemical behaviour of copper anodes in aqueous thiourea (TU)-containing sulphuric acid wa...
The electrochemical behaviour of copper anodes in aqueous thiourea (TU)-containing sulphuric acid wa...
The anodic oxidation of sulphur dioxide dissolved either in distilled water or in acid solutions of ...
Electrowinning (EW) is becoming an increasingly important method of recovering copper from aqueous a...
The anodisation of copper electrodes in aqueous thiourea (TU) containing 0.5 M sulphuric acid is stu...
The growing interest in the electrowinning of copper has lead to several modifications including ano...
Cupric ions are a major component in electrolyte baths for Damascene copper plating. To unravel the ...
As it is known, electrolytic processes use up electrical energy to bring about redox reactions. In t...
A combination of thermodynamic analyses and potentiodynamic polarization tests have been used to stu...
The oxidation of covellite, CuS, to copper(II) and sulfur or sulfate ions in aqueous ammonia is slow...
The oxidation kinetics of molten copper sulphide were investigated by quantitative measurements and ...
The effect of chloride ion on the deposition of copper from low metal concentrations in aqueous, aci...