Discrete electrical components such as capacitors, resistors, resonators, and inductors are still soldered onto the surfaces. The next generation of technology will be to integrate these components into or onto a low temperature co-fired ceramic substrate (LTCC). The objective of this work is to develop thin film sputtering techniques that will yield single layer capacitors directly on top of a LTCC substrate. It is desirable to minimize the size of the capacitor by increasing the K or decreasing the thickness. At the same time the dielectric must have a high insulation resistance. The capacitors were made from 50 nm nickel electrodes and a 300nm BaTiO3 dielectric. A physical mask of 74um x 74 um was used to increase the number of viable te...
Low Temperature Cofired Ceramic (LTCC) is a versatile ceramic packaging technology. LTCC\u27s functi...
Multilayer ceramic capacitors designed to be embedded in a low temperature co-fired ceramic substrat...
In last few years the increase in the level of functions required of wireless communications has nec...
Discrete electrical components such as capacitors, resistors, resonators, and inductors are still so...
Capacitor, resistor and inductor are passive components that occupy over 50% of board space and acco...
Thin film multilayers hare previously been introduced on multilayer low temperature cofired ceramic ...
As microprocessors move towards higher frequencies, lower operating voltages and higher power consum...
With the digital systems moving towards higher frequencies, lower operating voltages and higher powe...
Capacitors are critical devices in microelectronic assemblies that must be incorporated into electro...
Current methods for the manufacturing of multilayer ceramic capacitors (MLCCs) typically involve tap...
Simple thin-film capacitor stacks were fabricated from sputter-deposited doped barium titanate diele...
Single layer thin film capacitor structures were fabricated on the surface of low temperature co-fir...
Capacitor structures aiming at filtering and decoupling capacitors for DC-DC conversion, based on BS...
Abstract: Capacitor structures aiming at filtering and decoupling capacitors for DC-DC conversion, b...
Cette thèse porte sur l’intégration de condensateurs accordables à base de BaxSr1-xTiO3 (BST), pour ...
Low Temperature Cofired Ceramic (LTCC) is a versatile ceramic packaging technology. LTCC\u27s functi...
Multilayer ceramic capacitors designed to be embedded in a low temperature co-fired ceramic substrat...
In last few years the increase in the level of functions required of wireless communications has nec...
Discrete electrical components such as capacitors, resistors, resonators, and inductors are still so...
Capacitor, resistor and inductor are passive components that occupy over 50% of board space and acco...
Thin film multilayers hare previously been introduced on multilayer low temperature cofired ceramic ...
As microprocessors move towards higher frequencies, lower operating voltages and higher power consum...
With the digital systems moving towards higher frequencies, lower operating voltages and higher powe...
Capacitors are critical devices in microelectronic assemblies that must be incorporated into electro...
Current methods for the manufacturing of multilayer ceramic capacitors (MLCCs) typically involve tap...
Simple thin-film capacitor stacks were fabricated from sputter-deposited doped barium titanate diele...
Single layer thin film capacitor structures were fabricated on the surface of low temperature co-fir...
Capacitor structures aiming at filtering and decoupling capacitors for DC-DC conversion, based on BS...
Abstract: Capacitor structures aiming at filtering and decoupling capacitors for DC-DC conversion, b...
Cette thèse porte sur l’intégration de condensateurs accordables à base de BaxSr1-xTiO3 (BST), pour ...
Low Temperature Cofired Ceramic (LTCC) is a versatile ceramic packaging technology. LTCC\u27s functi...
Multilayer ceramic capacitors designed to be embedded in a low temperature co-fired ceramic substrat...
In last few years the increase in the level of functions required of wireless communications has nec...