[[abstract]]The electrodeposition nature of copper on a gold electrode in a 4.8 pH CuSO4 solution was inquired using X-ray absorption spectroscopy, electrochemical quartz crystal microbalance, and thermal desorption spectroscopy techniques. Our results point out that the electrodeposition of copper prompts the formation of stable oxi-hydroxide species with a formal oxidation state Cu+ without the evidence of metallic copper formation (Cu0). Moreover, the subsequent anodic polarization of Cu2Oaq yields the formation of CuO, in the formal oxidation state Cu2+, which is dissolved at higher anodic potential. It was found that the dissolution process needs less charge than that required for the electrodeposition indicating a nonreversible proces...
The nucleation mechanisms of copper during electrodeposition of thin films from sulfate solutions we...
The behaviour of the electroplated copper film electrode on tin oxide/glass or glassy carbon surface...
The state was investigated of the copper surface in phosphate buffered saline (PBS; 140 mM Cl-, 10 m...
[[abstract]]The electrodeposition nature of copper on a gold electrode in a 4.8 pH CuSO4 solution wa...
The electrodeposition nature of copper on a gold electrode in a 4.8 pH CuSO4 solution was inquired u...
The electrochemistry of copper deposition and dissolution in chloride–sulphate electrolytes has been...
The electrochemical behaviour of copper in 6.0 mol 1-1 sulfuric acid at 30°C, was studied by means o...
A novel procedure of anodic electrodeposition of copper oxides and hydroxides on glassy carbon and n...
The present report refers to the potentiodynamic characteristics of the electrochemical formation an...
Films formed on Cu(P) (with 0.1 atom percent P) and oxygen free high conductivity Cu anodes in elect...
The anodic oxidation of copper in LiOH solution has been investigated by galvanostatic, potentiostat...
The ionic equilibrium of the species in the CuSO4–H2SO4–H2O system was employed to systematize the c...
The effects of additives on copper electrodeposition processes have been investigated with electroch...
The ionic equilibrium of the species in the CuSO4-H2SO4-H2O system was employed to systematize the c...
The effect of chloride ion on the deposition of copper from low metal concentrations in aqueous, aci...
The nucleation mechanisms of copper during electrodeposition of thin films from sulfate solutions we...
The behaviour of the electroplated copper film electrode on tin oxide/glass or glassy carbon surface...
The state was investigated of the copper surface in phosphate buffered saline (PBS; 140 mM Cl-, 10 m...
[[abstract]]The electrodeposition nature of copper on a gold electrode in a 4.8 pH CuSO4 solution wa...
The electrodeposition nature of copper on a gold electrode in a 4.8 pH CuSO4 solution was inquired u...
The electrochemistry of copper deposition and dissolution in chloride–sulphate electrolytes has been...
The electrochemical behaviour of copper in 6.0 mol 1-1 sulfuric acid at 30°C, was studied by means o...
A novel procedure of anodic electrodeposition of copper oxides and hydroxides on glassy carbon and n...
The present report refers to the potentiodynamic characteristics of the electrochemical formation an...
Films formed on Cu(P) (with 0.1 atom percent P) and oxygen free high conductivity Cu anodes in elect...
The anodic oxidation of copper in LiOH solution has been investigated by galvanostatic, potentiostat...
The ionic equilibrium of the species in the CuSO4–H2SO4–H2O system was employed to systematize the c...
The effects of additives on copper electrodeposition processes have been investigated with electroch...
The ionic equilibrium of the species in the CuSO4-H2SO4-H2O system was employed to systematize the c...
The effect of chloride ion on the deposition of copper from low metal concentrations in aqueous, aci...
The nucleation mechanisms of copper during electrodeposition of thin films from sulfate solutions we...
The behaviour of the electroplated copper film electrode on tin oxide/glass or glassy carbon surface...
The state was investigated of the copper surface in phosphate buffered saline (PBS; 140 mM Cl-, 10 m...