In this study, different heatsink geometries used for electronic cooling are studied and compared to each other to determine the most efficient. The goal is to optimize heat transfer of the heat sinks studied in a range of configuration based on fin geometry. Heat sinks are thermal conductive material devices designed to absorb and disperse heat from high-temperature objects (e.g. Computer CPU). Common materials used in the manufacturing of heat sinks are aluminum and copper due to their relatively high thermal conductivity and lightweight [1]. Aluminum is used as the material for the heatsinks studied in this research project. To start, experimental results from a wind tunnel test conducted were compared to numerical results generated to e...