This thesis addresses the dependability issues in on-chip systems from a thermal perspective. This includes an explanation and analysis of models to show the relationship between dependability and tempature. Additionally, multiple novel methods for on-chip thermal management are introduced aiming to optimize thermal properties. Analysis of the methods is done through simulation and through infrared thermal camera measurements
In deep submicron era, thermal hot spots and large temperature gradients significantly impact system...
Recently, processor power density has been increasing at an alarming rate result- ing in high on-chi...
Fueled by increasing human appetite for high computing performance, semiconductor technology has now...
Over the past decades, the shrinking transistor size enabled more transistors to be integrated into ...
Over the past decades, the shrinking transistor size enabled more transistors to be integrated into ...
This thesis investigates the challenge of providing an abstracted, yet sufficiently accurate reliabi...
Energy efficiency is a key design goal for future computing systems. With diverse components interac...
Over the past decades, the shrinking transistor size enabled more transistors to be integrated into ...
The high power density of a many-core processor results in increased temperature which negatively im...
Advancements in IC processing technology has led to the innovation and growth happening in the consu...
Catering to society’s demand for high performance computing, billions of transistors are now integra...
The advent of multi-core platforms in critical realtime domains such as the avionics, automotive and...
One of the most prominent industrial applications of heat transfer science and engineering has been...
Editor's note: Thermal management in high-performance multicore platforms has become exceedingly com...
L'augmentation de la densité des transistors dans les circuits électroniques conduit à une augmentat...
In deep submicron era, thermal hot spots and large temperature gradients significantly impact system...
Recently, processor power density has been increasing at an alarming rate result- ing in high on-chi...
Fueled by increasing human appetite for high computing performance, semiconductor technology has now...
Over the past decades, the shrinking transistor size enabled more transistors to be integrated into ...
Over the past decades, the shrinking transistor size enabled more transistors to be integrated into ...
This thesis investigates the challenge of providing an abstracted, yet sufficiently accurate reliabi...
Energy efficiency is a key design goal for future computing systems. With diverse components interac...
Over the past decades, the shrinking transistor size enabled more transistors to be integrated into ...
The high power density of a many-core processor results in increased temperature which negatively im...
Advancements in IC processing technology has led to the innovation and growth happening in the consu...
Catering to society’s demand for high performance computing, billions of transistors are now integra...
The advent of multi-core platforms in critical realtime domains such as the avionics, automotive and...
One of the most prominent industrial applications of heat transfer science and engineering has been...
Editor's note: Thermal management in high-performance multicore platforms has become exceedingly com...
L'augmentation de la densité des transistors dans les circuits électroniques conduit à une augmentat...
In deep submicron era, thermal hot spots and large temperature gradients significantly impact system...
Recently, processor power density has been increasing at an alarming rate result- ing in high on-chi...
Fueled by increasing human appetite for high computing performance, semiconductor technology has now...