In this paper, a parasitic capacitance model for a single three-dimensional (3-D) wire above a plate is developed. The model decomposes electric field into various regions and gives solutions to each part. The total capacitance is the summation of all capacitance parts corresponding to the electric field distribution. The model's physical base minimizes its complexity and error comparing to a traditional empirical fitting process. Verified by extensive COMSOL simulations, the model can accurately predict parasitic capacitance for a wide range of BEOL wire dimensions. Thus, it holds potential to be further investigated for circuit simulation and design.CPCI-S(ISTP)166-17
In this paper, we analyze and model the impact of floating dummy fill on the signal capacitance cons...
State-of-the-art power converter topologies such as resonant converters are either designed with or ...
Parasitic capacitive couplings in the machine slots act as an undesired leakage current path. This p...
In this paper, a parasitic capacitance model for a single three-dimensional (3-D) wire above a plate...
In this brief, a parasitic capacitance model for a finite single three-dimensional (3-D) wire above ...
In the design of scaling complementary metal-oxide-semiconductor (CMOS), back-end-of-the-line (BEOL)...
In the design of scaling complementary metal-oxide-semiconductor (CMOS), back-end-of-the-line (BEOL)...
Considering both two-dimensional and three-dimensional single wire above plate, the proposed method ...
Considering both two-dimensional and three-dimensional single wire above plate, the proposed method ...
Abstract — An efficient algorithm for three-dimensional (3-D) capacitance extraction on multi-layere...
In this paper, an analytical model for parasitic gate capacitances in gate-all-around cylindrical si...
The influence of parasitic effects on the performance of VLSI circuits can be improved by reducing t...
Electrification of transportation is a major subject of research today, especially in air travel. Th...
Abstract—We develop an empirical model for the crossover ca-pacitance induced by the wire crossings ...
INTRODUCTION With the decrease of feature sizes and the increase of chip dimensions in integrated c...
In this paper, we analyze and model the impact of floating dummy fill on the signal capacitance cons...
State-of-the-art power converter topologies such as resonant converters are either designed with or ...
Parasitic capacitive couplings in the machine slots act as an undesired leakage current path. This p...
In this paper, a parasitic capacitance model for a single three-dimensional (3-D) wire above a plate...
In this brief, a parasitic capacitance model for a finite single three-dimensional (3-D) wire above ...
In the design of scaling complementary metal-oxide-semiconductor (CMOS), back-end-of-the-line (BEOL)...
In the design of scaling complementary metal-oxide-semiconductor (CMOS), back-end-of-the-line (BEOL)...
Considering both two-dimensional and three-dimensional single wire above plate, the proposed method ...
Considering both two-dimensional and three-dimensional single wire above plate, the proposed method ...
Abstract — An efficient algorithm for three-dimensional (3-D) capacitance extraction on multi-layere...
In this paper, an analytical model for parasitic gate capacitances in gate-all-around cylindrical si...
The influence of parasitic effects on the performance of VLSI circuits can be improved by reducing t...
Electrification of transportation is a major subject of research today, especially in air travel. Th...
Abstract—We develop an empirical model for the crossover ca-pacitance induced by the wire crossings ...
INTRODUCTION With the decrease of feature sizes and the increase of chip dimensions in integrated c...
In this paper, we analyze and model the impact of floating dummy fill on the signal capacitance cons...
State-of-the-art power converter topologies such as resonant converters are either designed with or ...
Parasitic capacitive couplings in the machine slots act as an undesired leakage current path. This p...