Strain analysis of complex three-dimensional nanobridges conducted via Raman spectroscopy requires careful experimentation and data analysis supported by simulations. A method combining micro-Raman spectroscopy with finite element analysis is presented, enabling a detailed understanding of strain-sensitive Raman data measured on Si nanobridges. Power-dependent measurements are required to account for the a priori unknown scattering efficiency related to size and geometry. The experimental data is used to assess the validity of previously published phonon deformation potentials
The physical properties of materials can be manipulated by applying stress or strain. For instance, ...
Nowadays, strain engineering plays a key role in boosting the performance of Si-based nanoelectronic...
Strained silicon underneath the field-effect transistor gate increases significantly the charge carr...
The strain-shift coefficient used to convert Raman shifts to strain depends on multiple factors incl...
State-of-the-art electronic devices are nowadays well into the nanometer regime. Raman spectroscopy ...
Raman microspectroscopy has been used to determine the volumetric micro-strain distribution in mecha...
Raman microspectroscopy has been used to determine the volumetric micro-strain distribution in mecha...
Micron-scale characterization of mechanical stresses is essential for the successful design and oper...
In this work, 100 nm-thick boron-doped silicon beams with doping levels between 1 × 1016 and 1 × 102...
Crystalline nanostructures such as silicon nanowires (SiNWs) may have residual mechanical stress and...
International audienceGe under high strain is predicted to become a direct bandgap semiconductor. Ve...
Strain engineering is used to maintain Moore's Law in scaled CMOS devices and as a technology booste...
In this work, strain in silicon free standing beams loaded in uniaxial tension is experimentally and...
Test structures consisting of shallow trench isolation (STI) structures are fabricated using advance...
To investigate the stress fields in local isolation structures, convergent beam electron diffraction...
The physical properties of materials can be manipulated by applying stress or strain. For instance, ...
Nowadays, strain engineering plays a key role in boosting the performance of Si-based nanoelectronic...
Strained silicon underneath the field-effect transistor gate increases significantly the charge carr...
The strain-shift coefficient used to convert Raman shifts to strain depends on multiple factors incl...
State-of-the-art electronic devices are nowadays well into the nanometer regime. Raman spectroscopy ...
Raman microspectroscopy has been used to determine the volumetric micro-strain distribution in mecha...
Raman microspectroscopy has been used to determine the volumetric micro-strain distribution in mecha...
Micron-scale characterization of mechanical stresses is essential for the successful design and oper...
In this work, 100 nm-thick boron-doped silicon beams with doping levels between 1 × 1016 and 1 × 102...
Crystalline nanostructures such as silicon nanowires (SiNWs) may have residual mechanical stress and...
International audienceGe under high strain is predicted to become a direct bandgap semiconductor. Ve...
Strain engineering is used to maintain Moore's Law in scaled CMOS devices and as a technology booste...
In this work, strain in silicon free standing beams loaded in uniaxial tension is experimentally and...
Test structures consisting of shallow trench isolation (STI) structures are fabricated using advance...
To investigate the stress fields in local isolation structures, convergent beam electron diffraction...
The physical properties of materials can be manipulated by applying stress or strain. For instance, ...
Nowadays, strain engineering plays a key role in boosting the performance of Si-based nanoelectronic...
Strained silicon underneath the field-effect transistor gate increases significantly the charge carr...