High frequency C-V curves were taken of NMOS capacitors to determine the effect that a RF oxygen plasma has on the underlying thin gate oxide. This plasma was used to remove a positive photoresist. The C-V curves show a threshold voltage shift of 3.75 volts with respect to the undamaged capacitors. The C-V curves also show that the thinner were more affected than the thicker oxides
The radiation impact on antenna devices can give new insights on basic mechanisms underlying the lat...
A novel plasma-process induced damage depassivation method is proposed. Using a staircase-like stres...
Damage in thin (10 nm) oxide layers of metal-oxide-semiconductor varactor cells caused by exposures ...
High frequency C-V curves were taken of NMOS capacitors to determine the effect that a RF oxygen pla...
Capacitance-Voltage (C-V) arid Conductance-Voltage (G-V) measurements were performed to characterize...
Abstract—Plasma-induced damage in various 3-nm-thick gate oxides (i.e., pure oxides and N 2 O-nitrid...
Two mechanisms of plasma processing damage to thin gate oxide structures were studied. Thin 17.5 mu ...
While plasma-induced charging damage has been widely studied in recent years, much of the work has c...
Damage of the gate oxide induced by plasma processing, due to charge buildup on conductors in ohmic ...
Charge accumulation on an insulating ate oxide may cause electrostatic breakdown. Exposing a wafer c...
Plasma treatments are widely used in microelectronic industry but they may leave some residual passi...
Plasma process induced damage has been widely investigated in the past few years. We present in this...
We present new experimental data about the radiation-induced breakdown in 1.7 mn gate oxides, typica...
Variations in both MOS capacitor structure and fabrication process were characterized using 1MHz C-V...
Plasma treatments, indispensable for manufacturing of ULSI integrated circuits, may lead to a latent...
The radiation impact on antenna devices can give new insights on basic mechanisms underlying the lat...
A novel plasma-process induced damage depassivation method is proposed. Using a staircase-like stres...
Damage in thin (10 nm) oxide layers of metal-oxide-semiconductor varactor cells caused by exposures ...
High frequency C-V curves were taken of NMOS capacitors to determine the effect that a RF oxygen pla...
Capacitance-Voltage (C-V) arid Conductance-Voltage (G-V) measurements were performed to characterize...
Abstract—Plasma-induced damage in various 3-nm-thick gate oxides (i.e., pure oxides and N 2 O-nitrid...
Two mechanisms of plasma processing damage to thin gate oxide structures were studied. Thin 17.5 mu ...
While plasma-induced charging damage has been widely studied in recent years, much of the work has c...
Damage of the gate oxide induced by plasma processing, due to charge buildup on conductors in ohmic ...
Charge accumulation on an insulating ate oxide may cause electrostatic breakdown. Exposing a wafer c...
Plasma treatments are widely used in microelectronic industry but they may leave some residual passi...
Plasma process induced damage has been widely investigated in the past few years. We present in this...
We present new experimental data about the radiation-induced breakdown in 1.7 mn gate oxides, typica...
Variations in both MOS capacitor structure and fabrication process were characterized using 1MHz C-V...
Plasma treatments, indispensable for manufacturing of ULSI integrated circuits, may lead to a latent...
The radiation impact on antenna devices can give new insights on basic mechanisms underlying the lat...
A novel plasma-process induced damage depassivation method is proposed. Using a staircase-like stres...
Damage in thin (10 nm) oxide layers of metal-oxide-semiconductor varactor cells caused by exposures ...