Novel Plating Cell Geometry for Uniform Metal Deposition

processing cells based on an innovative cell geometry that results in high levels of processing uniformity. This geometry is comprised of a number of unique attributes for the uniform electrodeposition or electroetching of metals across large planar substrates as well as fine features that are utilized for printed circuit board (PCB) and electronic packaging applications. The cell has been characterized with a 457 mm x 610 mm substrate. A coefficient of variation of 5.3 % was achieved in FARADAYIC® ElectroCell over a 457 mm x 610 mm substrate; these values were compared to a commercial system. This cell design has been applied to a number of industrial processes, including electroplating of copper, trivalent chromium and platinum and electroetching of copper for interlayer circuit board applications. The current work outlines the importance of various cell components and resulting uniformity