Displacement of the suppressor polyethylene glycol (PEG) by the accelerant 3-mercapto-1-propanesulfonate (MPS) during copper electrodeposition was studied by a chronoamperometric addition technique. Displacement of PEG occurs through a process of MPS domain nucleation, mass-transfer limited domain expansion and an asymptotic approach to equilibrium between MPS in solution and that on the surface. An isotherm is proposed to account for the equilibrium coverage over a wide range of MPS concentrations, and the nearest neighbor separation between adsorbed MPS molecules during deposition is estimated. © The Author(s) 2014. Published by ECS. This is an open access article distributed under the terms of the Creative Common
Polymerizates of imidazole and epichlorohydrin (Imep) serve as one of the benchmarks for today's che...
The trend to miniaturize electronic devices has led to the development of new fabrication processes....
Copper electrodeposition on copper from still plating solutions of different compositions was invest...
Polyethylene glycol (PEG) is an important additive to electroplating baths used in the damascene pro...
Poly(ethylene glycol) (PEG) is an important additive to electroplating baths used for the deposition...
The adsorption kinetics of polyethylene glycol (PEG) during Cu electroless deposition was investigat...
Deposition of copper in Through Silicon Vias (TSVs) is achieved by addition of organic compounds, wh...
[[abstract]]c2003 Springer - The adsorption behaviour of polyethylene glycol (PEG) in the presence o...
The desorption / adsorption of suppressor additive during Cu electroplating plays a critical role in...
In damascene copper plating with polyethylene glycol (PEG) and bis – (3–sulfopropyl) disulfide (SPS)...
An electrochemical quartz crystal microbalance (EQCM) has been used to examine the role of polyethyl...
This research deals with the effects of PEG during Cu electrodeposition from an acidic sulphate solu...
The addition of polyethylene glycol (PEG) and Cl- to an acid copper electrolyte inhibits the deposit...
ppe ern n 970 d to th ct-free terist re sim f poly the p en wh allow the a, and 600 A eceive ders t...
This paper deals with the effects of PEG during Cu electrodeposition from an acidic sulphate solutio...
Polymerizates of imidazole and epichlorohydrin (Imep) serve as one of the benchmarks for today's che...
The trend to miniaturize electronic devices has led to the development of new fabrication processes....
Copper electrodeposition on copper from still plating solutions of different compositions was invest...
Polyethylene glycol (PEG) is an important additive to electroplating baths used in the damascene pro...
Poly(ethylene glycol) (PEG) is an important additive to electroplating baths used for the deposition...
The adsorption kinetics of polyethylene glycol (PEG) during Cu electroless deposition was investigat...
Deposition of copper in Through Silicon Vias (TSVs) is achieved by addition of organic compounds, wh...
[[abstract]]c2003 Springer - The adsorption behaviour of polyethylene glycol (PEG) in the presence o...
The desorption / adsorption of suppressor additive during Cu electroplating plays a critical role in...
In damascene copper plating with polyethylene glycol (PEG) and bis – (3–sulfopropyl) disulfide (SPS)...
An electrochemical quartz crystal microbalance (EQCM) has been used to examine the role of polyethyl...
This research deals with the effects of PEG during Cu electrodeposition from an acidic sulphate solu...
The addition of polyethylene glycol (PEG) and Cl- to an acid copper electrolyte inhibits the deposit...
ppe ern n 970 d to th ct-free terist re sim f poly the p en wh allow the a, and 600 A eceive ders t...
This paper deals with the effects of PEG during Cu electrodeposition from an acidic sulphate solutio...
Polymerizates of imidazole and epichlorohydrin (Imep) serve as one of the benchmarks for today's che...
The trend to miniaturize electronic devices has led to the development of new fabrication processes....
Copper electrodeposition on copper from still plating solutions of different compositions was invest...