The addition of polyethylene glycol (PEG) and Cl- to an acid copper electrolyte inhibits the deposition reaction for cathodic overpotentials of up to about 150 mV. Adding Cl- only promotes the deposition reaction, while adding PEG alone has a relatively small effect on electrode kinetics. Frequency shifts of an electrochemical quartz crystal microbalance sug-gest the adsorption of a monolayer of PEG molecules that are collapsed into spheres provided chloride ions are present, with little adsorption occurring when Cl- is absent. This behavior is the same for gold and copper surfaces. Transient cur-rent measurements suggest that chloride ions affect the PEG adsorption equilibrium rather than adsorption kinetics alone
Copper electrodeposition on copper from still plating solutions of different compositions was invest...
The adsorption of polyethyleneglycol with different molecular weights (PEGX; x = 400, 3000, 8000, or...
The trend to miniaturize electronic devices has led to the development of new fabrication processes....
Many articles have shown that polyethylene glycol (PEG), when combined with chloride ions, is a stro...
An electrochemical quartz crystal microbalance (EQCM) has been used to examine the role of polyethyl...
Many articles have shown that polyethylene glycol (PEG), when combined with chloride ions, is a stro...
The charge-transfer reaction between copper(II) and copper electrodes is studied in electrolytes tha...
[[abstract]]c2003 Springer - The adsorption behaviour of polyethylene glycol (PEG) in the presence o...
Poly(ethylene glycol) (PEG) is an important additive to electroplating baths used for the deposition...
Polyethylene glycol (PEG) is an important additive to electroplating baths used in the damascene pro...
ppe ern n 970 d to th ct-free terist re sim f poly the p en wh allow the a, and 600 A eceive ders t...
In the electrochemical deposition of copper on structured substrates, additives are commonly used as...
The kinetics of the Cu/Cu2+ have been defined clearly from experiments on a copper microdisc el...
The adsorption kinetics of polyethylene glycol (PEG) during Cu electroless deposition was investigat...
The charge-transfer reaction between copper(II) and copper electrodes is studied in electrolytes tha...
Copper electrodeposition on copper from still plating solutions of different compositions was invest...
The adsorption of polyethyleneglycol with different molecular weights (PEGX; x = 400, 3000, 8000, or...
The trend to miniaturize electronic devices has led to the development of new fabrication processes....
Many articles have shown that polyethylene glycol (PEG), when combined with chloride ions, is a stro...
An electrochemical quartz crystal microbalance (EQCM) has been used to examine the role of polyethyl...
Many articles have shown that polyethylene glycol (PEG), when combined with chloride ions, is a stro...
The charge-transfer reaction between copper(II) and copper electrodes is studied in electrolytes tha...
[[abstract]]c2003 Springer - The adsorption behaviour of polyethylene glycol (PEG) in the presence o...
Poly(ethylene glycol) (PEG) is an important additive to electroplating baths used for the deposition...
Polyethylene glycol (PEG) is an important additive to electroplating baths used in the damascene pro...
ppe ern n 970 d to th ct-free terist re sim f poly the p en wh allow the a, and 600 A eceive ders t...
In the electrochemical deposition of copper on structured substrates, additives are commonly used as...
The kinetics of the Cu/Cu2+ have been defined clearly from experiments on a copper microdisc el...
The adsorption kinetics of polyethylene glycol (PEG) during Cu electroless deposition was investigat...
The charge-transfer reaction between copper(II) and copper electrodes is studied in electrolytes tha...
Copper electrodeposition on copper from still plating solutions of different compositions was invest...
The adsorption of polyethyleneglycol with different molecular weights (PEGX; x = 400, 3000, 8000, or...
The trend to miniaturize electronic devices has led to the development of new fabrication processes....