Abstract: Precision grinding of silicon carbide ceramic micro-structured moulds is becoming more common in the area of the moulding of glass materials. However, in micro-structured grinding of super-hard and brittle materials, problems frequently occur in terms of chipping and rounding of micro-structural edge features. In order to overcome these technological con-straints, a promising method using ultrasonic vibration of workpiece materials is proposed. The design of a novel ultrasonic vibration apparatus and the experimental investigation of ultrasonic vibration assisted grinding of SiC micro-structures are presented. The experimental results show that the application of ultrasonic vibration can enhance the ground surface qual-ity and imp...
Advanced ceramic materials become more and more important for industrial applications, where resista...
The grinding force is an important index during the grinding process, which affects the surface qual...
Abstract: Based on the single abrasive particle motion locus of elliptical spiral in two-dimensional...
Abstract: Precision grinding of silicon carbide ceramic micro-structured moulds is becoming more com...
Due to the differences in mechanical properties of Al and SiC particles, the problems of SiC particl...
A new method of ultrasonic chemical mechanical polishing (CMP) combined with ultrasonic lapping is i...
A new method of ultrasonic chemical mechanical polishing (CMP) combined with ultrasonic lapping is i...
Advanced technical ceramics have a large potential in mechanical engineering, especially for applica...
AbstractIn conventional grinding of hard to cut materials such as Ti6Al4V alloys, surface burning, r...
China National Natural Science Foundation [50905150]An experimental study of polysilicon grinding wi...
Abstract. The grain cutting trace of elliptical spiral in workpiece two-dimensional ultrasonic vibra...
Nowadays, engineering ceramics have significant applications in different industries such as; automo...
Nowadays, engineering ceramics have significant applications in different industries such as; automo...
Nowadays, engineering ceramics have significant applications in different industries such as; automo...
Ultrasonic assisted grinding processes promise high potential for economical machining of brittle ha...
Advanced ceramic materials become more and more important for industrial applications, where resista...
The grinding force is an important index during the grinding process, which affects the surface qual...
Abstract: Based on the single abrasive particle motion locus of elliptical spiral in two-dimensional...
Abstract: Precision grinding of silicon carbide ceramic micro-structured moulds is becoming more com...
Due to the differences in mechanical properties of Al and SiC particles, the problems of SiC particl...
A new method of ultrasonic chemical mechanical polishing (CMP) combined with ultrasonic lapping is i...
A new method of ultrasonic chemical mechanical polishing (CMP) combined with ultrasonic lapping is i...
Advanced technical ceramics have a large potential in mechanical engineering, especially for applica...
AbstractIn conventional grinding of hard to cut materials such as Ti6Al4V alloys, surface burning, r...
China National Natural Science Foundation [50905150]An experimental study of polysilicon grinding wi...
Abstract. The grain cutting trace of elliptical spiral in workpiece two-dimensional ultrasonic vibra...
Nowadays, engineering ceramics have significant applications in different industries such as; automo...
Nowadays, engineering ceramics have significant applications in different industries such as; automo...
Nowadays, engineering ceramics have significant applications in different industries such as; automo...
Ultrasonic assisted grinding processes promise high potential for economical machining of brittle ha...
Advanced ceramic materials become more and more important for industrial applications, where resista...
The grinding force is an important index during the grinding process, which affects the surface qual...
Abstract: Based on the single abrasive particle motion locus of elliptical spiral in two-dimensional...