Elaboration of copper-tin alloys coatings: effect of glycine

Despite the coatings progress, addition of organic additives is limited or restricted in electrolytes with environmental regulations. The electrochemical deposition of Cu-Sn alloy is studied in acidic sulfate electrolyte at pH 1 and room temperature. The present work focuses on the behavior of the copper-tin alloys using glycine as additive to identify the action mechanism of this substance on alloys. Voltammetric analyses display three cathodic and anodic peaks, for Cu-Sn alloys with or without glycine. Alloy composition and their structure are investigated by EDS and XRD. The effect of glycine on copper-tin alloys has been investigated by glow discharge optical emission spectroscopy (GDOES). The SEM images reveal a very specific morphology in the presence of the glycine. A very homogeneous granular surface is obtained, formed by clusters with a decrease of this size. Glycine is a grain refiner to Cu-Sn alloys and the mechanism of electrodeposition of copper-tin alloys is not modified