This paper is an overview of the main physical effects that can prevent a deep sub-micron IC from working, or impair its reliability. We will discuss both signal and design integrity problems. Signal Integrity problems are those DSM effects that prevent your chip from working as designed, even when new. Design integrity problems are those that cannot be detected by testing, but may cause your chip to fail in the field. This paper and the accompanying lecture describe each problem, the physics behind it, and how it can be avoided or worked around in the design. It also describe how automatic tools can help address these problems
The signal integrity issue has become more important with down-scaling of feature sizes, because cro...
This is the industry’s most comprehensive, authoritative, and practical guide to modern Signal Integ...
ISBN: 0769506135IC technologies are approaching the ultimate limits of silicon in terms of device si...
Advancement in CMOS technology has become a driving force in the advancement of today\u27s IC design...
International audienceAdvances in interconnect technologies, such as the increase in the number of m...
One of the most imp01tant advances in deep sub-micron level design is in the area of signal integrit...
The last few years have witnessed a revolution in integrated circuit (IC) fabrication technology lea...
The last few years have witnessed a revolution in integrated circuit (IC) fabrication technology lea...
The last few years have witnessed a revolution in integrated circuit (IC) fabrication technology lea...
"Signal Integrity Characterization Techniques" addresses the gap between traditional digital and mic...
This tutorial describes the problems encountered in typical ultra-deep submicron (UDSM) designs, and...
With the scaling of feature sizes into Deep-Submicron (DSM) values, the level of integration and per...
This is the industry’s most comprehensive, authoritative, and practical guide to modern Signal Integ...
The signal integrity issue has become more important with down-scaling of feature sizes, because cro...
The signal integrity issue has become more important with down-scaling of feature sizes, because cro...
The signal integrity issue has become more important with down-scaling of feature sizes, because cro...
This is the industry’s most comprehensive, authoritative, and practical guide to modern Signal Integ...
ISBN: 0769506135IC technologies are approaching the ultimate limits of silicon in terms of device si...
Advancement in CMOS technology has become a driving force in the advancement of today\u27s IC design...
International audienceAdvances in interconnect technologies, such as the increase in the number of m...
One of the most imp01tant advances in deep sub-micron level design is in the area of signal integrit...
The last few years have witnessed a revolution in integrated circuit (IC) fabrication technology lea...
The last few years have witnessed a revolution in integrated circuit (IC) fabrication technology lea...
The last few years have witnessed a revolution in integrated circuit (IC) fabrication technology lea...
"Signal Integrity Characterization Techniques" addresses the gap between traditional digital and mic...
This tutorial describes the problems encountered in typical ultra-deep submicron (UDSM) designs, and...
With the scaling of feature sizes into Deep-Submicron (DSM) values, the level of integration and per...
This is the industry’s most comprehensive, authoritative, and practical guide to modern Signal Integ...
The signal integrity issue has become more important with down-scaling of feature sizes, because cro...
The signal integrity issue has become more important with down-scaling of feature sizes, because cro...
The signal integrity issue has become more important with down-scaling of feature sizes, because cro...
This is the industry’s most comprehensive, authoritative, and practical guide to modern Signal Integ...
ISBN: 0769506135IC technologies are approaching the ultimate limits of silicon in terms of device si...