-n b Wire bonding Ultrasonic

gna k-s me with of 110 C. The results of the process optimization show that the shear strength cpk values of Cu ball bonds ng pro ctions this a One of the most suitable methods to this end is to use microsen-sors to measure the in situ forces caused by the ultrasound induced to the pad during bonding. The Au ball bond on Al pad bonding process was characterized using piezo-resistive microsensors [1–3]. Based on the harmonics of the recorded ultrasonic signal, five bond phases are distinguished during the process. The third harmonic of the ultrasonic force signal was used to explain two ison of the in situ signals obtained with two Cu wire types having different hardnesses is given. 2. Experimental Thermosonic ball-wedge bonding is performed using a fully automatic ESEC 3100 wire bonder manufactured by Oerlikon ESEC, Cham, Switzerland, with a nominal ultrasonic frequency of 128 kHz. The bonding is performed using a standard Au wire, a soft Cu wire (Cu–S), and a hard Cu wire (Cu–H), all 25 lm (1 mil) i