Two types of ultrasonic transducers: full ceramics (lead zirconate titanate, PZT) and composite (PZT embedded in a polymer) transducers, were used for wire bonding. Al wire is 32 μm in diameter and bond pads contain Au/Ni/Cu trilayer coating on PCB boards. Bonding Al wire on the pads was processed on three different power levels and with various bond times at each bond power to compare the bonding performance of the two types of transducers. The actual bond areas were measured after the Al wire had been removed in a base solution. Bonding kinetics was analyzed based on actual bond areas. Pull strength test was used to examine bonding quality. The fractured bonds were examined using a scanning electron microscope. The results show that the b...
The effect of bonding parameters on the reliability of thick Al wire bond is investigated. Samples w...
Common ultrasound transducers utilize epoxy for bonding the active piezoelectric to the rest of the ...
The effect of bonding parameters on the reliability of thick Al wire bond is investigated. Samples w...
xvii, 191, 7 leaves : ill. ; 30 cm.PolyU Library Call No.: [THS] LG51 .H577P AP 2004 LiAdvanced tran...
In-situ studies on the performance of an ultrasonic wire-bonding transducer (about 60 kHz) are prese...
An aluminum wire bonding process was developed. Techniques were developed for bonding large diameter...
For high-temperature ultrasonic transducers piezoelement-to-metal thermosonic bonding technology was...
The effect of bonding parameters on the reliability of thick Al wire bond is investigated. Samples w...
Three identical lead zirconate titanate (PZT) sensor rings have been inserted in different locations...
xxiii, 271 leaves : ill. (some col.) ; 30 cm.PolyU Library Call No.: [THS] LG51 .H577P AP 2001 OrStu...
Al wire bonding, also called ultrasonic wedge-wedge bonding, is a microwelding process used extensiv...
gna k-s me with of 110 C. The results of the process optimization show that the shear strength cpk v...
The purpose of this work is to evaluate the feasibility of room temperature wedge-wedge bonding usin...
Piezocomposite ultasonic transducers for high-frequency microelectronics wire bonding have been deve...
In this study, a sensing cum actuating (SCA) technique is developed to study the wire bonding system...
The effect of bonding parameters on the reliability of thick Al wire bond is investigated. Samples w...
Common ultrasound transducers utilize epoxy for bonding the active piezoelectric to the rest of the ...
The effect of bonding parameters on the reliability of thick Al wire bond is investigated. Samples w...
xvii, 191, 7 leaves : ill. ; 30 cm.PolyU Library Call No.: [THS] LG51 .H577P AP 2004 LiAdvanced tran...
In-situ studies on the performance of an ultrasonic wire-bonding transducer (about 60 kHz) are prese...
An aluminum wire bonding process was developed. Techniques were developed for bonding large diameter...
For high-temperature ultrasonic transducers piezoelement-to-metal thermosonic bonding technology was...
The effect of bonding parameters on the reliability of thick Al wire bond is investigated. Samples w...
Three identical lead zirconate titanate (PZT) sensor rings have been inserted in different locations...
xxiii, 271 leaves : ill. (some col.) ; 30 cm.PolyU Library Call No.: [THS] LG51 .H577P AP 2001 OrStu...
Al wire bonding, also called ultrasonic wedge-wedge bonding, is a microwelding process used extensiv...
gna k-s me with of 110 C. The results of the process optimization show that the shear strength cpk v...
The purpose of this work is to evaluate the feasibility of room temperature wedge-wedge bonding usin...
Piezocomposite ultasonic transducers for high-frequency microelectronics wire bonding have been deve...
In this study, a sensing cum actuating (SCA) technique is developed to study the wire bonding system...
The effect of bonding parameters on the reliability of thick Al wire bond is investigated. Samples w...
Common ultrasound transducers utilize epoxy for bonding the active piezoelectric to the rest of the ...
The effect of bonding parameters on the reliability of thick Al wire bond is investigated. Samples w...