[[abstract]]Poly-Si0.8Ge0.2 and poly-Si gate n-channel metal oxide semiconductor capacitors with very thin gate oxides were fabricated. Poly-gate depletion effects (PDE) in these devices were analyzed. Lower sheet resistance, higher dopant activation rate, higher active dopant concentration near the poly/SiO2 interface, and, therefore, improved PDE were found in phosphorus-implanted poly-Si0.8Ge0.2 gate as compared to poly-Si gate devices. As a result, poly-Si0.8Ge0.2 gate devices provide more inversion charge and therefore potentially provide higher current drive in metal oxide semiconductor transistors ©1998 The Electrochemical Society[[fileno]]2030158010046[[department]]電機工程學
We show that poly-SiGe can be readily integrated as a gate material into an existing CMOS technology...
The characteristics of typical sub-100 nm high K gate dielectrics MOSFET with different gate materia...
We show that poly-SiGe can be readily integrated as a gate material into an existing CMOS technology...
The success of the microelectronics industry over more then 30 years is to a large extent based on u...
[[abstract]]Poly-Si1-xGex-gated MOS capacitors were fabricated with x varying from 0 to 0.5. NMOS an...
The gate bias polarity dependence of stress-induced leakage current (SILC) of PMOS capacitors with a...
In this paper the I-V conduction mechanism for gate injection (-V g), Stress-Induced Leakage Current...
Polycrystalline Si1-xGex (poly Si-Ge) was explored as a process compatible alternative gate material...
SiGe alloys are currently used for HBT and MOS as epitaxial layers for base or strained channel, res...
This paper presents the study of the polysilicon gate depletion effect (PDE) on the threshold voltag...
Thin Film Transistors have been fabricated in 0.2 urn thick polycrystalline silicon. NMOS and PMOS d...
Poly-Si gate with pre-implanted dopant is found to minimize the effect of poly-depletion which is ca...
BF2 implanted stacked z-silicon (SAS) electrode capacitors were fabricated on n-type silicon substra...
Fowler-Nordheim (FN) tunnel current and oxide reliability of PRiLOS capacitors with a p+ polycrystal...
Scaling down of the CMOS technology requires thinner gate dielectric to maintain high performance. H...
We show that poly-SiGe can be readily integrated as a gate material into an existing CMOS technology...
The characteristics of typical sub-100 nm high K gate dielectrics MOSFET with different gate materia...
We show that poly-SiGe can be readily integrated as a gate material into an existing CMOS technology...
The success of the microelectronics industry over more then 30 years is to a large extent based on u...
[[abstract]]Poly-Si1-xGex-gated MOS capacitors were fabricated with x varying from 0 to 0.5. NMOS an...
The gate bias polarity dependence of stress-induced leakage current (SILC) of PMOS capacitors with a...
In this paper the I-V conduction mechanism for gate injection (-V g), Stress-Induced Leakage Current...
Polycrystalline Si1-xGex (poly Si-Ge) was explored as a process compatible alternative gate material...
SiGe alloys are currently used for HBT and MOS as epitaxial layers for base or strained channel, res...
This paper presents the study of the polysilicon gate depletion effect (PDE) on the threshold voltag...
Thin Film Transistors have been fabricated in 0.2 urn thick polycrystalline silicon. NMOS and PMOS d...
Poly-Si gate with pre-implanted dopant is found to minimize the effect of poly-depletion which is ca...
BF2 implanted stacked z-silicon (SAS) electrode capacitors were fabricated on n-type silicon substra...
Fowler-Nordheim (FN) tunnel current and oxide reliability of PRiLOS capacitors with a p+ polycrystal...
Scaling down of the CMOS technology requires thinner gate dielectric to maintain high performance. H...
We show that poly-SiGe can be readily integrated as a gate material into an existing CMOS technology...
The characteristics of typical sub-100 nm high K gate dielectrics MOSFET with different gate materia...
We show that poly-SiGe can be readily integrated as a gate material into an existing CMOS technology...