Describes the creep behavior of three Sn-rich solders that have become candidates for use in Pb-free solder joints: Sn-3.5Ag, Sn-3Ag-0.5Cu and Sn-0.7Cu. The three solders show the same general behavior when tested in thin joints between Cu and Ni/Au metallized pads at temperatures between 60 and 130\260C. Their steady-state creep rates are separated into two regimes with different stress exponents(n). The low-stress exponents range from ~;3-6, while the high-stress exponents are anomalously high (7-12). Strikingly, the high-stress exponent has a strong temperature dependence near room temperature, increasing significantly as the temperature drops from 95 to 60\260C. The anomalous creep behavior of the solders appears to be due to the...
In this paper, we investigated the intermetallic compound (IMC) morphology of aged (0, 200, 600 h) c...
To better understand the factors governing the reliability of lead free solders during severe excurs...
The constitutive mechanical behaviour with a focus on creep of Sn-Pb and various Sn-Ag-Cu based Pb-f...
Describes the creep behavior of three Sn-rich solders that have become candidates for use in Pb-free...
This paper discusses the creep behavior of example Sn-rich solders that have become candidates for u...
The creep rate of Sn solder joints is noticeably affected by joint metallization. Cu|Sn|Cu joints ha...
In order to acquire relevant creep characteristics such as stress exponent and activation energy, cr...
Full implementation of the new generation of lead-free solders requires a detailed knowledge and und...
A critical survey of the current literature on creep behavior of Pb-free Sn based Sn-Ag-Cu (SAC) all...
Solder joints in electronic packages are prone to failure due to the evolution of thermal expansion ...
Solder joints are the main weak points of power modules used in harsh environments. For the power mo...
Service conditions experienced by interconnections are becoming increasingly arduous. Temperature ra...
It has been conventional to simplify the thermo-mechanical modeling of solder joints by omitting the...
An experimental investigation was conducted to characterize and measure the contributions of shear a...
The paper aims to examine the creep performance of lead-free solder, SAC387 (95.5Sn-3.8Ag-0.7Cu) at ...
In this paper, we investigated the intermetallic compound (IMC) morphology of aged (0, 200, 600 h) c...
To better understand the factors governing the reliability of lead free solders during severe excurs...
The constitutive mechanical behaviour with a focus on creep of Sn-Pb and various Sn-Ag-Cu based Pb-f...
Describes the creep behavior of three Sn-rich solders that have become candidates for use in Pb-free...
This paper discusses the creep behavior of example Sn-rich solders that have become candidates for u...
The creep rate of Sn solder joints is noticeably affected by joint metallization. Cu|Sn|Cu joints ha...
In order to acquire relevant creep characteristics such as stress exponent and activation energy, cr...
Full implementation of the new generation of lead-free solders requires a detailed knowledge and und...
A critical survey of the current literature on creep behavior of Pb-free Sn based Sn-Ag-Cu (SAC) all...
Solder joints in electronic packages are prone to failure due to the evolution of thermal expansion ...
Solder joints are the main weak points of power modules used in harsh environments. For the power mo...
Service conditions experienced by interconnections are becoming increasingly arduous. Temperature ra...
It has been conventional to simplify the thermo-mechanical modeling of solder joints by omitting the...
An experimental investigation was conducted to characterize and measure the contributions of shear a...
The paper aims to examine the creep performance of lead-free solder, SAC387 (95.5Sn-3.8Ag-0.7Cu) at ...
In this paper, we investigated the intermetallic compound (IMC) morphology of aged (0, 200, 600 h) c...
To better understand the factors governing the reliability of lead free solders during severe excurs...
The constitutive mechanical behaviour with a focus on creep of Sn-Pb and various Sn-Ag-Cu based Pb-f...